OLED Backplane Heavily Doped Resin Electrode
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Solution Overview
Problem
The conventional OLED backplane fabrication process is complex and prone to discharging phenomena at the edges of transparent electrodes, leading to device damage, and requires multiple patterning and etching steps that consume ITO material.
Innovation Solution
A method involving the formation of a heavily doped resin layer that serves as both the pixel electrode and pixel defining layer, achieved through ion implantation and curing of a resin layer, which eliminates the need for separate transparent electrode and pixel defining layer patterning processes, and prevents discharging by forming a complete layer structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate transparent electrode and pixel defining layer patterning processes are used, then precise electrode positioning is achieved, but fabrication complexity increases and ITO material is consumed
Solution Approach 1:
The patent merges the transparent electrode layer and pixel defining layer into a single resin layer structure. The resin layer simultaneously serves as the transparent electrode material and the pixel defining boundary, eliminating the need for separate patterning processes for both layers and reducing ITO material consumption.
Solution Approach 2:
The resin layer is designed to perform multiple functions: it acts as the transparent electrode material for charge transport, serves as the pixel defining layer for sub-pixel boundaries, and provides structural support. This multi-functionality eliminates the need for separate dedicated layers for each function.
2Manufacturing precision
If multiple patterning and etching steps are used, then precise sub-pixel definition is achieved, but fabrication time and material consumption increase
Solution Approach 1:
The patent combines the pixel defining function and electrode function into a single resin layer that is patterned in one step. This single patterning process defines both the sub-pixel boundaries and the electrode positions simultaneously, eliminating multiple sequential patterning and etching steps.
Solution Approach 2:
The resin layer is deposited and patterned before the organic light-emitting layer formation, establishing the complete pixel electrode and defining structure in advance. This preliminary action prevents the need for subsequent etching steps that would be required if layers were processed separately.
3Reliability
If transparent electrode edges are exposed, then electrode connectivity is maintained, but discharging phenomena occur causing device damage
Solution Approach 1:
The patent merges the transparent electrode and pixel defining layer into a single resin layer, eliminating the exposed edges that occur at the boundaries between separate transparent electrode and defining layers. This unified structure prevents the discharging phenomena that occur at interface edges.
Solution Approach 2:
The patent converts the potential harm of exposed electrode edges by designing the resin layer to extend beyond the electrode boundaries, using the resin material itself to cap and protect the electrode edges from discharging, thereby transforming a potential failure point into a protective feature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This simplifies the fabrication process, saves ITO material, and prevents edge discharging, resulting in a more reliable and efficient OLED backplane.
Implementation Method 1
Heavily doping the resin layer of a first region in each sub-pixel on the substrate including the resin layer, so that the resin layer in the first region is conductive
Implementation Method 2
Performing light exposure on the resin material in the pixel electrode region by half-tone exposure, performing deep exposure on the resin material in the passivation-layer via-hole region and a surrounding region thereof by half-tone exposure
Data Source
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AI summary
An OLED backboard and a manufacturing method therefor are provided. The manufacturing method for the OLED backboard comprises: forming a pattern comprising TFTs on a substrate; forming a passivation layer (3) on the substrate with the pattern comprising the TFTs; forming a color film (4) on the substrate comprising the passivation layer (3); forming a resin layer (8) on the substrate comprising the color film (4); heavily doping the resin layer (8) in a first area (9) in each sub-pixel on the substrate comprising the resin layer (8) to endow electrical conductivity to the resin layer (8) in the first area (9), wherein the first area (9) comprises a passivation layer through hole area (2), a pixel electrode area (1) and a communicating area between the passivation layer through the hole area (2) and the pixel electrode area (1), and the drains of the TFTs are in the passivation layer through hole areas (2); sequentially forming an organic luminous layer and a cathode on the substrate, the resin layer (8) in the first area (9) of which has been heavily doped.