OLED Display Substrate Sealant Layout for Corrosion Protection
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Solution Overview
Problem
Organic Light-Emitting Diode (OLED) display devices are susceptible to degradation due to water vapor and oxygen penetration, leading to oxidation of metal and organic layers, which reduces the service life and causes non-light-emitting areas to form.
Innovation Solution
A display substrate with a sealant region surrounding the display area, including a corner sealant region with an encapsulation base layer, and a power line and signal line configuration that enhances the encapsulation effect by increasing the contact area with frame sealants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation methods such as frame encapsulation glue and encapsulation cover plate are used to prevent water vapor and oxygen penetration, then the protection against corrosion is improved, but the contact area between sealants and the display substrate is reduced, weakening the encapsulation effect
Solution Approach 1:
The patent extends the encapsulation base layer in the vertical direction (thickness dimension) to increase the contact area between the sealant region and the display substrate. By making the encapsulation base layer have a greater thickness, the sealant can contact a larger surface area of the substrate, thereby improving the encapsulation effect without increasing the planar footprint of the device.
2Strength
If the encapsulation base layer thickness is increased to improve encapsulation effect, then the adhesion between sealants and display substrate is enhanced, but the device structure becomes more complex and manufacturing difficulty increases
Solution Approach 1:
The encapsulation base layer is designed to serve multiple functions: it provides mechanical support, creates the sealant contact area for encapsulation, and defines the structural boundary of the sealant region. By making this single layer multi-functional, the patent avoids adding separate components that would increase device complexity, while still achieving enhanced adhesion and encapsulation effect.
3Object-affected harmful factors
If the sealant region is designed with larger contact area to improve encapsulation, then the resistance to water vapor and oxygen penetration is improved, but the manufacturing precision requirements increase due to the complex power line and signal line configurations
Solution Approach 1:
The patent applies different structural characteristics to different regions: the encapsulation base layer has increased thickness specifically in the sealant contact region to improve encapsulation, while the power lines and signal lines maintain their standard dimensions and configurations in their respective functional areas. This localized differentiation allows each region to be optimized for its specific function without compromising manufacturing precision elsewhere.
Data Source
AI summary
A display substrate, a method for manufacturing the same and a display device. In the display substrate, a sealant region includes: a corner sealant region, a lead-in sealant region, and a first sealant region on a first side of a display area. The corner sealant region is provided with an encapsulation base layer. A non-display area is provided with a second power line, a gate drive circuit and multiple first signal lines configured to provide signals to the gate drive circuit. The second power line includes a power line corner portion and a first power line portion, the first power line portion overlaps the first sealant region, and the first power line portion extends in a first direction. A target portion of each first signal line is at least located in the corner sealant region.