OLED Display Substrate Sealant Layout for Corrosion-Resistant Encapsulation
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Solution Overview
Problem
Existing OLED display devices are susceptible to water vapor and oxygen penetration, leading to oxidation of metal and organic layers, which accelerates device aging and reduces lifespan, and current encapsulation methods like Frit glue and encapsulation cover plates may not effectively prevent corrosion due to the laser sintering process narrowing the glue layer.
Innovation Solution
A display substrate design featuring a sealant region with an encapsulation base layer, power lines, and signal lines that overlap to form an encapsulation base, increasing contact area with frame sealants and improving adhesion, while avoiding a large-area encapsulation base layer to save manufacturing costs and enhance encapsulation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a large-area encapsulation base layer is used to increase contact area with frame sealants, then adhesion is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the encapsulation base layer with existing functional structures (power lines and signal lines) to form a composite encapsulation base. This integration allows the encapsulation base to utilize the contact area of these existing structures with the frame sealants, thereby improving adhesion without requiring additional large-area materials or complex manufacturing processes.
2Manufacturing precision
If the Frit glue layer is narrowed during laser sintering to improve encapsulation precision, then sealing effect is improved, but the risk of electrochemical corrosion increases
Solution Approach 1:
The patent performs preliminary action by forming the encapsulation base layer before the laser sintering process. This encapsulation base layer is positioned to contact the frame sealant in advance, creating a protective barrier that prevents water and oxygen from reaching the power lines and signal lines during subsequent encapsulation and operation, thereby preventing electrochemical corrosion while allowing the Frit glue to be narrowed for precision.
3Reliability
If existing encapsulation methods are used to prevent water vapor and oxygen penetration, then device protection is improved, but manufacturing complexity increases
Solution Approach 1:
The patent makes the existing power lines and signal lines multi-functional by having them serve both their original electrical function and as part of the encapsulation base structure. These conductive structures simultaneously provide electrical connectivity and act as the base that contacts the frame sealant for encapsulation, eliminating the need for separate encapsulation base layers and reducing manufacturing complexity while maintaining device protection.
Data Source
AI summary
A display substrate, a method for manufacturing the same and a display device. In the display substrate, a sealant region includes: a corner sealant region, a lead-in sealant region, and a first sealant region on a first side of a display area. The corner sealant region is provided with an encapsulation base layer. A non-display area is provided with a second power line, a gate drive circuit and multiple first signal lines configured to provide signals to the gate drive circuit. The second power line includes a power line corner portion and a first power line portion, the first power line portion overlaps the first sealant region, and the first power line portion extends in a first direction. A target portion of each first signal line is at least located in the corner sealant region.