OLED Display Sealant Reinforcing Member Adhesion
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Solution Overview
Problem
Organic light emitting diode displays face challenges in maintaining adequate adhesion between the display substrate and sealing member, especially as the thickness of the substrate decreases, leading to reduced device strength and increased risk of defects during manufacturing.
Innovation Solution
Incorporating a reinforcing member with controlled shear strength and hardness, formed by capillary action, which includes materials like urethane acrylate and epoxy resin, to enhance adhesion between the display substrate and sealing member, adhering to specific constants in the equation X ≥ (Y - B × t + C) to ensure stable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the display substrate is decreased to achieve thinner displays, then the device becomes more compact and modern, but the adhesion between the display substrate and sealing member deteriorates, leading to reduced device strength and increased manufacturing defects
Solution Approach 1:
The patent introduces a reinforcing member as an intermediary element positioned between the display substrate and sealing member. This reinforcing member has controlled shear strength and hardness properties that are specifically designed to compensate for the reduced adhesion caused by thinner substrates. The reinforcing member acts as a mediator that transfers and distributes mechanical stresses, preventing direct stress concentration at the substrate-sealing member interface and thereby maintaining overall bond strength despite the reduced substrate thickness.
Solution Approach 2:
The patent employs composite material strategies by combining the display substrate, sealant, reinforcing member, and sealing member into a multi-layer composite structure. The reinforcing member is formed from materials with specific mechanical properties (controlled shear strength and hardness) that complement the softer display substrate and harder sealing member. This composite approach allows each layer to contribute its optimal properties, with the reinforcing member providing the necessary mechanical reinforcement to compensate for the thinner substrate design.
2Length of moving object
If the thickness of the display substrate is decreased, then the overall device thickness is reduced, but the device strength and reliability during manufacturing deteriorate
Solution Approach 1:
The reinforcing member serves as a structural intermediary that bridges the display substrate and sealing member, providing enhanced mechanical support during the manufacturing process. Its controlled shear strength allows it to absorb and distribute manufacturing stresses, preventing damage to the thin substrate while maintaining the integrity of the sealed structure. This intermediary element ensures that the device can withstand handling and assembly operations despite the reduced substrate thickness.
3Strength
If a reinforcing member with high shear strength is used to improve adhesion, then the bonding strength increases, but the hardness may increase excessively affecting flexibility and bonding performance
Solution Approach 1:
The patent applies parameter changes by precisely controlling the shear strength and hardness of the reinforcing member within specific ranges. Rather than using maximally hard materials, the reinforcing member is formulated with optimized parameters that provide sufficient bonding strength while maintaining appropriate flexibility. The shear strength is controlled to be high enough to ensure reliable bonding, but the hardness is kept within a range that allows the reinforcing member to conform to the substrate and sealing member surfaces, ensuring good contact and bonding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcing member effectively increases adhesion and device strength, maintaining a predetermined level of bonding even with thinner substrates, thereby improving the reliability and manufacturing process of organic light emitting diode displays.
Implementation Method 1
The reinforcing member may be formed by capillary action
Data Source
AI summary
An organic light emitting diode display may include a display substrate including an organic light emitting diode, a sealing member facing the display substrate to cover the organic light emitting diode, a sealant positioned between the display substrate and the sealing member and bonding the display substrate and the sealing member, and a reinforcing member positioned at an outer surface of the sealant and a space between the display substrate and the sealing member, in which shear stress and hardness of the reinforcing member are a function of a sum of thicknesses of the display substrate and the sealing member.