OLED Sealing Member Through Holes Bonding Strength
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Solution Overview
Problem
The mechanical strength between the sealing member and the lower substrate in organic light-emitting display apparatuses is insufficient when the width of the sealing member is reduced, leading to degraded sealing properties and bonding forces between the substrates.
Innovation Solution
Incorporating a first metal layer with through portions and a second metal layer with corresponding through portions, along with insulating layers having fine holes, to increase the contact area and bonding strength between the sealing member and the lower substrate, while also allowing for heat dissipation during the sealing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the width of the sealing member is reduced to minimize dead space, then the display area is maximized, but the mechanical strength and bonding force between the sealing member and lower substrate become insufficient
Solution Approach 1:
The sealing member is divided into multiple segments along its length, with through portions creating separate bonding zones. This segmentation allows the sealing member to maintain adequate bonding strength in each zone while reducing the overall width and dead space of the sealing structure.
Solution Approach 2:
The sealing member features localized variations in width and bonding structure. The through portions create regions with enhanced bonding characteristics (greater contact area with substrate) while other regions maintain reduced width. This local quality variation ensures sufficient bonding force at critical points while minimizing overall dead space.
2Area of stationary object
If the width of the sealing member is reduced to minimize dead space, then the display area is maximized, but the sealing property degrades
Solution Approach 1:
The sealing member is divided into multiple segments along its length, with through portions creating separate bonding zones. This segmentation allows the sealing member to maintain adequate bonding strength in each zone while reducing the overall width and dead space of the sealing structure.
Solution Approach 2:
Instead of relying solely on the width (one dimension) of the sealing member for bonding strength, the invention introduces vertical dimensionality through the through portions that extend into the substrate. This multi-dimensional bonding approach maintains sealing reliability while allowing reduced horizontal width.
Data Source
AI summary
An organic light-emitting display apparatus includes a lower substrate having a display area and a peripheral area around the display area; an upper substrate facing the lower substrate; a display unit at the display area of the lower substrate; a sealing member at the peripheral area of the lower substrate and configured to bond the lower substrate to the upper substrate; and a first metal layer between the lower substrate and the sealing member and having a plurality of first through portions extending in a first direction.