OLED Display Panel Stress Releasing Structure
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Solution Overview
Problem
OLED display panels face issues with metal wiring rupture during the bending process, leading to stress accumulation and reduced manufacturing yield due to the existing stress management techniques.
Innovation Solution
A stress releasing structure is implemented in the display panel's bending area, comprising a planarization layer and a pixel defining layer with semicircular-columns parallel to each other, which helps distribute and alleviate tensile stress on metal wirings, along with a photo spacer layer, all made of polyimide material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the bending area includes metal wiring, planarization layer, and pixel defining layer during bending process, then the display panel can be bent to reduce edge frame width, but stress accumulates in metal wirings causing rupture and reduced manufacturing yield
Solution Approach 1:
The planarization layer and pixel defining layer are divided into multiple semicircular-columns arranged parallel to each other, creating a segmented structure that allows stress distribution and release during bending, preventing metal wiring rupture while maintaining the required shape transformation
Solution Approach 2:
The planarization layer and pixel defining layer are formed with semicircular-column shapes that match the bending curvature requirements. This curved geometry allows the layers to flex smoothly during the bending process, reducing stress concentration on the metal wirings while achieving the desired bent shape for edge frame width reduction
2Reliability
If conventional planarization layer and pixel defining layer are used without semicircular-columns, then the manufacturing process is simpler, but stress cannot be effectively released causing metal wiring rupture
Solution Approach 1:
The planarization layer and pixel defining layer are segmented into multiple semicircular-columns rather than using continuous layers. This segmentation enables stress release during bending while the columnar structure can be integrated into existing manufacturing processes, balancing reliability improvement with acceptable process complexity
Solution Approach 2:
The physical structure of the planarization layer and pixel defining layer is changed from continuous flat layers to semicircular-column structures. This parameter change in geometry allows the material to accommodate bending stresses through the curved shapes, improving wiring integrity while the columns can be formed using modified photolithography and etching processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stress releasing structure effectively reduces the likelihood of metal wiring rupture, enhancing the reliability and yield of OLED display panels by distributing stress across the semicircular-columns and polyimide layers during the bending process.
Implementation Method 1
at least one of the planarization layer and the pixel defining layer includes a plurality of semicircular-columns parallel to each other... the semicircular-columns... help distribute and alleviate tensile stress on metal wirings
Implementation Method 2
all made of polyimide material... effectively reduces the likelihood of metal wiring rupture, enhancing the reliability and yield of OLED display panels by distributing stress across the semicircular-columns and polyimide layers
Data Source
AI summary
The present disclosure provides a display panel having a stress releasing structure and a method for manufacturing the same. The display panel having a stress releasing structure includes a substrate having a display area, a bending area, and a peripheral area, wherein the bending area is positioned between the display area and the peripheral area; a metal wiring disposed on the substrate and extending from the display area to the peripheral area; a planarization layer positioned in the bending area and disposed on the metal wiring; and a pixel defining layer positioned in the bending area and disposed on the planarization layer; wherein at least one of the planarization layer and the pixel defining layer includes a plurality of semi-columns parallel to each other.