OLED Array Substrate Trench Layout for Single-Step Bending Relief

Solution Overview

Problem

The manufacturing process of OLED display panels with bended side frames requires multiple masks, increasing time and cost due to the complexity of forming trenches for stress reduction.

Innovation Solution

An array substrate design featuring a blocking part with an etching opening that allows for the formation of trenches in the first and second film layers using a single etching process, reducing the number of masks and processes needed without compromising performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If multiple masks are used to form trenches in the film layer structure, then the bending stress is effectively reduced, but the manufacturing time and cost increase

Engineering Contradiction:

Improvebending stress reductionVSAvoidmanufacturing time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The patent combines multiple trench formation operations into a single etching process. The first trench in the first film layer set and the second trench in the second film layer set are formed simultaneously using one etching step, eliminating the need for separate masking and etching operations for each trench type.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single etching process serves multiple functions: it forms both the first trench and the second trench, replaces multiple specialized etching steps, and achieves both stress reduction and manufacturing efficiency in one operation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Strength

If multiple masks are used to form trenches in the film layer structure, then the bending stress is effectively reduced, but the manufacturing cost increases

Engineering Contradiction:

Improvebending stress reductionVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent combines multiple trench formation operations into a single etching process. The first trench in the first film layer set and the second trench in the second film layer set are formed simultaneously using one etching step, eliminating the need for separate masking and etching operations for each trench type.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single etching process serves multiple functions: it forms both the first trench and the second trench, replaces multiple specialized etching steps, and achieves both stress reduction and manufacturing efficiency in one operation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If multiple etching processes are used to form trenches, then precise control over each trench is achieved, but the manufacturing complexity increases

Engineering Contradiction:

Improvetrench formation precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple trench formation operations into a single etching process. The first trench in the first film layer set and the second trench in the second film layer set are formed simultaneously using one etching step, eliminating the need for separate masking and etching operations for each trench type.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11984459B2Array substrate and OLED display panel

Publication Date: 2024.05.14 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD

AI summary

An array substrate and an OLED display panel are provided. The array substrate includes a base substrate, a first film layer set and a second film layer set. A bending area of the array substrate has a first trench throughout the first film layer set and a second trench throughout the second film layer set. The first film layer set close to the second film layer set has a blocking part having an etching opening corresponding to the first trench. The etching opening is throughout the blocking part. A bottom of the etching opening connects to a top of the first trench. A bottom of the second trench connects to a top of the blocking part.