OLED Substrate Voids for Desiccant Moisture Protection
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Solution Overview
Problem
Flexible organic light-emitting devices (OLEDs) face challenges in protecting against environmental contaminants like moisture and oxygen, as conventional desiccant arrangements are not suitable for flexible substrates, leading to degradation and reduced device lifetime.
Innovation Solution
Incorporating a desiccant within voids in the substrate, which are covered by an environmental barrier, allowing the desiccant to absorb moisture that penetrates through the barrier, while maintaining a compact device footprint and preventing lateral moisture ingress, especially during flexion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional desiccant arrangement is used in flexible OLEDs, then moisture protection is provided, but the device footprint increases and flexibility is compromised
Solution Approach 1:
The desiccant is nested within the substrate structure itself, specifically within voids or cavities formed in the substrate. This integration allows the desiccant to be housed within the existing device footprint without requiring additional external space, thereby maintaining compact dimensions while providing effective moisture protection
Solution Approach 2:
The desiccant is positioned in the vertical dimension within substrate voids rather than occupying horizontal plane space. By utilizing the thickness dimension of the substrate for desiccant placement, the solution protects against moisture ingress without increasing the device's lateral footprint
2Reliability
If a conventional desiccant arrangement is used in flexible OLEDs, then moisture protection is provided, but flexibility is compromised
Solution Approach 1:
The desiccant is nested within the substrate structure itself, specifically within voids or cavities formed in the substrate. This integration allows the desiccant to be housed within the existing device footprint without requiring additional external space, thereby maintaining compact dimensions while providing effective moisture protection
Solution Approach 2:
The substrate is designed with flexible materials and structures that can bend and flex without compromising the integrity of the desiccant containment. The environmental barrier and substrate are engineered as thin, flexible layers that maintain their protective function while allowing the device to be bent or flexed during use
3Adaptability or versatility
If the environmental barrier is made thinner for flexible devices, then flexibility is improved, but moisture penetration increases
Solution Approach 1:
The desiccant is positioned within the substrate voids to preemptively absorb moisture that penetrates through the environmental barrier. This preliminary protective action occurs at the substrate level, providing an additional safeguard against moisture damage even when the barrier is thin
Solution Approach 2:
The desiccant serves as a cushioning protective measure against moisture ingress. By having the desiccant in place within the substrate, the system prepares in advance to neutralize any moisture that manages to penetrate the environmental barrier, preventing harmful effects before they can damage the OLED
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively protects OLEDs from environmental contaminants, reducing degradation and extending the device's useful lifetime without increasing the device's footprint, and is particularly effective in flexible OLEDs where lateral moisture ingress is a concern.
Implementation Method 1
a desiccant disposed in the void in the substrate... the desiccant to absorb moisture that penetrates through the barrier
Data Source
AI summary
Electronic devices that use desiccants for protection from moisture. The electronic devices comprise a substrate and an organic element disposed over the top surface of the substrate. The substrate has one or more voids which may store desiccants. The voids may penetrate partially or completely through the thickness of the substrate. An environmental barrier is disposed over the organic element and the voids. Also provided are methods for making electronic devices that use desiccants.


