Organic EL Display Substrate with Segmented Thickness and Grooves
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Solution Overview
Problem
Organic electroluminescent display devices face issues with deterioration due to bending and protrusions, which affect their reliability and display quality, especially when the encapsulation substrate is vulnerable to external impacts and moisture penetration.
Innovation Solution
The method involves fabricating an organic electroluminescent display device with a second substrate having varying thickness regions and forming grooves in the encapsulation substrate to accommodate an absorbent material, which reduces the risk of damage from bending and external forces, while also enabling upper emission type displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the encapsulation substrate is made thin to reduce device thickness, then the device profile is improved, but the substrate becomes vulnerable to bending and external impacts
Solution Approach 1:
The encapsulation substrate is segmented into multiple thickness regions: a first thickness in the display area, a second thickness in the non-display area, and a third thickness (grooves) at the boundary. This segmentation allows the substrate to be thin where needed for device profile while maintaining strength in critical areas through the thicker non-display region and protective grooves.
Solution Approach 2:
The substrate exhibits local quality variations with different thicknesses in different regions. The display area has a first thickness optimized for device thinness, the non-display area has a greater second thickness for structural support and impact resistance, and boundary grooves have a third thickness for stress relief. This local differentiation resolves the contradiction between overall thinness and localized strength.
2Reliability
If grooves are formed in the encapsulation substrate to accommodate absorbent material, then protection against moisture and external forces is improved, but the manufacturing process complexity increases
Solution Approach 1:
The grooves are formed in the encapsulation substrate before the final assembly step, during the substrate fabrication process itself. This preliminary action allows the absorbent material to be subsequently placed into pre-formed cavities, simplifying the overall manufacturing process compared to attempting to insert material into a fully assembled device.
Solution Approach 2:
The absorbent material is nested within the grooves formed in the encapsulation substrate. This nesting approach allows the protective material to be integrated into the substrate structure itself, providing moisture and impact protection without adding separate external components or increasing overall device complexity.
3Adaptability or versatility
If the substrate thickness is reduced to enable upper emission type displays, then display versatility is improved, but the substrate becomes more susceptible to breaks and cracks
Solution Approach 1:
The substrate thickness is segmented into a first thickness in the display area (enabling upper emission) and a greater second thickness in the non-display area (providing structural support). This segmentation allows the display region to be thin for light emission versatility while the non-display region maintains integrity and resistance to breaks and cracks.
Solution Approach 2:
Different regions of the substrate have different thickness qualities: the display area has reduced thickness for upper emission capability, while the non-display area has increased thickness for mechanical strength. This local quality differentiation enables the substrate to simultaneously achieve display versatility and structural reliability.
Data Source
AI summary
A method for fabricating an organic electroluminescent display device including the steps of preparing first and second substrates, forming an organic electroluminescent display on the first substrate, forming a first etching mask film on an upper surface of the second substrate, forming a second etching mask film on a lower surface of the second substrate, performing a first etching process on the upper surface of the second substrate, forming a third etching mask film on an etched portion of the second surface of the glass substrate, performing a second etching process on the upper surface of the second substrate to form a plurality of grooves on the upper surface of the second substrate, removing the first and second etching mask films, the second etching film remaining on the etched portion of the second surface of the glass substrate, and encapsulating the organic electroluminescent display between the first and second substrates.