OLED Substrate Heightened Part Blocks Light Leakage

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Solution Overview

Problem

In bottom emitting OLED display panels, light leakage occurs between sub-pixels due to gaps between signal wires, which is typically mitigated by widening sub-pixel spacing, compromising resolution.

Innovation Solution

A display substrate with a heightened part under the signal wires, where the signal wires cover the lateral sides of the heightened part, effectively blocking light leakage without altering the sub-pixel spacing, using materials like polysiloxane-based or polyimide-based materials for the heightened part.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the spacing d between two adjacent sub-pixels is widened to reduce light leakage, then light leakage is reduced, but the resolution of the OLED display panel is significantly influenced

Engineering Contradiction:
Improvelight leakageVSAvoidresolution
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent introduces a height dimension by forming a heightened part (insulating layer with greater thickness) at the signal wire gap region. This vertical elevation blocks light from escaping through the gap without requiring horizontal expansion of sub-pixel spacing, thus resolving the contradiction between reducing light leakage and maintaining resolution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If the spacing d between two adjacent sub-pixels is widened to reduce light leakage, then light leakage is reduced, but the area occupied by sub-pixels decreases

Engineering Contradiction:
Improvelight leakageVSAvoidsub-pixel area
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

By utilizing the vertical dimension through the heightened insulating layer, the patent achieves light leakage prevention without increasing horizontal sub-pixel spacing. This preserves the sub-pixel area and allows for higher pixel density while effectively blocking light escape paths.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If signal wires are placed closer together to maintain high resolution, then resolution is maintained, but light leakage increases

Engineering Contradiction:
ImproveresolutionVSAvoidlight leakage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a heightened insulating layer specifically at the signal wire gap regions where light leakage occurs. The insulating layer thickness is locally increased only where needed for light blocking, while maintaining standard thickness in other regions, thus preventing light leakage without affecting overall resolution.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The solution transitions from a two-dimensional planar structure to a three-dimensional structure by elevating the insulating layer vertically at critical locations. This height increase creates a physical barrier that blocks light leakage paths while allowing signal wires to remain closely spaced for high resolution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10943964B2Display substrate and manufacturing method thereof, and display apparatus
Publication Date: 2021.03.09 BOE TECHNOLOGY GROUP CO LTD
  • US10943964B2 patent drawing
  • US10943964B2 patent drawing
  • US10943964B2 patent drawing

AI summary

The present disclosure relates to a display substrate, a manufacturing method thereof, and a display device. The display substrate comprises: a plurality of sub-pixels arranged in an array; a base substrate; and an interlayer insulating layer, at least one heightened part and a plurality of signal wires, sequentially disposed on the base substrate, wherein an orthographic projection of the heightened part on the base substrate is located between orthographic projections of two adjacent sub-pixels on the base substrate, and two adjacent signal wires between the two adjacent sub-pixels are located on two sides of the heightened part and at least partially cover two lateral sides of the heightened part respectively.