OLED Substrate Through Hole Segmentation for Wiring Density

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Solution Overview

Problem

The density of connection wirings in OLED display devices is limited by the diameter and spacing of through holes in the substrate, leading to increased bezel size and potential cracking of metal wiring due to bent PCBs, which restricts the number of wirings that can be packed within a given area.

Innovation Solution

A substrate design with through holes divided into multiple connection holes by an insulator, allowing for increased wiring density by doubling the number of connections through the same number of holes, and eliminating the need for a bent PCB structure by attaching the PCB to the lower surface of the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If through holes are used to connect wirings from display area to PCB, then wiring connections are enabled, but the diameter and spacing of through holes limit the density of connection wirings

Engineering Contradiction:

Improvenumber of connection wiringsVSAvoidthrough hole diameter and spacing constraints

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

Each through hole is divided into multiple connection holes by inserting an insulator, allowing multiple wirings to be connected through a single through hole location. This segmentation enables increased wiring density without requiring additional through holes or reducing their spacing

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The insulator extends in the thickness direction of the substrate, dividing the through hole into multiple spatial segments. This dimensional approach allows multiple wirings to pass through the same planar location at different vertical positions, effectively increasing wiring density without changing the through hole layout

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If PCB is bent to attach to substrate, then connection is achieved, but metal wiring cracks may occur on the bent PCB

Engineering Contradiction:

ImprovePCB attachmentVSAvoidmetal wiring integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Instead of bending the PCB to match the substrate curvature, the substrate is designed with a flat lower surface that directly contacts the PCB. This inverts the conventional approach, eliminating the need for PCB bending and preventing wiring cracks while maintaining secure attachment

Inventive Principle:

Principle #13The other way round (Inversion)

3Quantity of substance

If through hole diameter and spacing are reduced to increase wiring density, then more wirings can be packed, but manufacturing difficulty increases

Engineering Contradiction:

Improvewiring densityVSAvoidthrough hole fabrication

Core Design Contradiction:

Quantity of substanceVSEase of manufacture

Solution Approach 1:

By dividing each through hole into multiple connection holes using an insulator, the patent achieves higher wiring density without reducing the physical dimensions of through holes. This maintains ease of manufacturing while increasing the number of connections

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS10991790B2Substrate and display device including the same

Publication Date: 2021.04.27 SAMSUNG DISPLAY CO LTD

AI summary

A display device includes: a substrate having a first surface, a second surface opposite to the first surface, and an inner side surface defining through holes; a first wiring and a second wiring disposed on the first surface; and a first conductor and a second conductor disposed in one of the through holes. The first conductor is connected to the first wiring, the second conductor is connected to the second wiring, and the first and second conductors are insulated from each other.