OLED Display Panel Through-Hole Laser Drilling Method
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for encapsulating organic light-emitting units in OLED display screens, such as fine metal mask (FMM) and inverse trapezoid pixel defining layers, are complex and costly, requiring multiple masks or additional manufacturing steps, which complicates the production of flexible OLEDs and increases costs.
Innovation Solution
A method involving a polyimide baseplate with sequential layers of inorganic and organic materials, where a first laser forms an opening through organic layers, followed by a thin-film encapsulation layer and a second opening using dry etching, and finally a perforated hole is created in the baseplate using a second laser, ensuring complete coverage of the organic light-emitting layer by inorganic layers to prevent encapsulation failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fine metal mask (FMM) or inverse trapezoid pixel defining layer techniques are used for encapsulation, then encapsulation failure is avoided, but manufacturing complexity and production cost increase
Solution Approach 1:
The patent extracts and removes the complex FMM or inverse trapezoid pixel defining layer structures, replacing them with a simplified approach where the pixel defining layer is eliminated entirely. The encapsulation function is achieved through a combination of planarization layer design and direct thin-film encapsulation, removing unnecessary manufacturing steps while maintaining encapsulation reliability.
Solution Approach 2:
Instead of using complex masks or inverted trapezoid structures to achieve encapsulation, the patent inverts the approach by using a flat pixel defining layer combined with precise thin-film encapsulation deposition. The encapsulation is achieved through the natural conformal coverage of the thin-film layers on the simplified structure, rather than forcing the organic layers into complex geometric configurations.
2Reliability
If multiple FMMs or additional manufacturing steps are used, then encapsulation failure is prevented, but production cost increases
Solution Approach 1:
The patent merges the pixel defining function with the planarization layer, eliminating the need for separate complex pixel defining structures. The thin-film encapsulation layers are deposited directly over this integrated structure, combining multiple functions into fewer manufacturing steps, thereby reducing production cost while maintaining encapsulation reliability.
Solution Approach 2:
The patent replaces expensive, complex FMM structures with simpler, more cost-effective planarization and thin-film encapsulation layers. The simplified structure achieves the same encapsulation function at lower material and manufacturing cost, making the production process more economically viable.
3Area of moving object
If laser cutting is used to form through-holes, then screen-to-body ratio is increased, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary patterning of the pixel defining layer and organic layers before thin-film encapsulation deposition. This preliminary structuring establishes precise reference positions that guide subsequent laser drilling, ensuring accurate through-hole positioning without requiring extremely high precision during the laser cutting step itself. The preliminary layers act as templates that pre-establish the geometric framework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces production costs, and effectively prevents encapsulation failure by ensuring the organic light-emitting layer is fully covered by inorganic layers, thereby enhancing the reliability and efficiency of OLED display panel production.
Implementation Method 1
forming a first opening at a location near to the organic light-emitting layer using a first laser, such that the first opening passes through the second common layer, the first common layer, the pixel defining layer, and the organic planarization layer of the array substrate
Implementation Method 2
forming a second opening at a location corresponding to the first opening using a dry etching technique, such that the second opening passes through the inorganic layer of the thin-film encapsulation layer and passes through the at least one inorganic layer of the array substrate
Implementation Method 3
forming a perforated hole in the baseplate at a location corresponding to the second opening using a second laser, thereby producing a through-hole in the OLED display panel
Data Source
AI summary
A method for manufacturing an OLED display panel is provided. The method includes steps of providing an array substrate; forming an OLED function layer including a first common layer, an organic light-emitting layer, and a second common layer on the array substrate; forming a first opening at a location near to the organic light-emitting layer using a first laser; forming a thin-film encapsulation layer on the OLED function layer; forming a second opening at a location corresponding to the first opening using a dry etching technique, the second opening passing through an inorganic layer of the thin-film encapsulation layer and at least one inorganic layer of the array substrate, and being connected to the first opening; and forming a perforated hole in the substrate at a location corresponding to the second opening using a second laser, thereby producing a through-hole in the OLED display panel.