OLED Via Hole Filling via Bank Structure
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Solution Overview
Problem
In the packaging process of OLED display devices, photoresist often fails to completely fill via holes, necessitating additional inkjet printing steps, which complicates production and hinders mass production.
Innovation Solution
The method involves forming a plurality of second banks within the via hole region on the substrate, eliminating the need for additional inkjet printing processes by ensuring complete filling of photoresist and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photoresist is used to fill via holes in the packaging process, then via hole filling is achieved, but incomplete filling occurs requiring additional inkjet printing processes
Solution Approach 1:
The patent introduces a bank structure formed before the via hole filling process. This bank serves as a preliminary structural guide that directs photoresist flow into the via hole during packaging, ensuring complete filling without requiring subsequent inkjet printing correction steps.
Solution Approach 2:
The bank acts as an intermediary structure between the via hole and the photoresist material. It mediates the filling process by controlling photoresist flow and distribution, ensuring complete and uniform filling of via holes during the packaging process.
2Manufacturing precision
If additional inkjet printing process is added to fill via holes, then via hole filling completeness is improved, but production difficulty increases and mass production capability is reduced
Solution Approach 1:
The bank structure is formed in advance during the patterning process, before via hole filling occurs. This preliminary structural preparation ensures that photoresist flows correctly into via holes during packaging, eliminating the need for additional inkjet printing steps and enabling mass production.
Solution Approach 2:
The patent extracts the via hole filling function from the subsequent inkjet printing process and integrates it into the packaging process itself. By using the bank structure to guide photoresist filling during packaging, the separate inkjet printing step becomes unnecessary, simplifying the overall manufacturing flow for mass production.
Data Source
AI summary
A method of manufacturing an organic light emitting diode display panel includes: providing a substrate, and a flexible film layer is formed on the substrate; forming an anode layer on the flexible film layer, and a via hole region is disposed on the anode layer, a camera is disposed at a side of the substrate facing away from the via hole region, and an orthographic projection region of the camera on the substrate is located in the via hole region; forming a first bank and a second bank at intervals in the via hole region, and the first bank and the second bank are both located in the orthographic projection region of the via hole region; depositing a light emitting layer and a cathode layer sequentially, and the light emitting layer and the cathode layer are configured to form a light emitting unit; and packaging the display panel.