OLED Wiring Structure with Stacked Conductive Layers
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Solution Overview
Problem
Existing OLED displays face challenges in securing low-resistance wiring and sufficient storage capacity, which affect their performance and manufacturing efficiency.
Innovation Solution
The OLED display design incorporates a wiring structure with a first conductive pattern layer, an intermediate insulation pattern layer, and a second conductive pattern layer stacked sequentially, connected through a via hole, and a storage capacitor formed on the same layer, allowing for low-resistance wiring and sufficient storage capacity. This design includes a planarization layer with a second via hole for contact metal extension and a bridge metal connecting the driving voltage line to the storage capacitor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer wiring structure is used, then the manufacturing process is simple, but the wiring resistance is high
Solution Approach 1:
The wiring is divided into multiple conductive pattern layers (first conductive pattern layer, second conductive pattern layer) stacked vertically and connected via via holes. This segmentation allows current to flow through multiple parallel paths, reducing overall wiring resistance while maintaining manufacturing feasibility through standardized multi-layer deposition processes.
Solution Approach 2:
The wiring structure transitions from a two-dimensional single-layer layout to a three-dimensional multi-layer stacked configuration. By adding the vertical dimension with via holes connecting different layers, the patent reduces resistance without complicating the horizontal manufacturing flow, as each layer is deposited using standard sequential processes.
2Device complexity
If the storage capacitor is formed separately from the wiring, then the wiring structure is simple, but the storage capacity is insufficient
Solution Approach 1:
The storage capacitor is merged with the wiring structure by forming both on the same layer using the same conductive pattern layers and intermediate insulation pattern layer. The capacitor electrodes are integrated into the existing wiring layers, allowing the storage function to be added without creating separate dedicated capacitor structures, thus increasing storage capacity while limiting structural complexity.
Solution Approach 2:
The conductive pattern layers and intermediate insulation pattern layer serve dual functions: they form both the wiring structures and the storage capacitor electrodes. This multi-functionality allows the same manufactured layers to fulfill both signal transmission and energy storage roles, maximizing storage capacity within the existing structural framework.
3Reliability
If multiple conductive pattern layers are stacked, then the wiring resistance is reduced, but the manufacturing process becomes complex
Solution Approach 1:
The intermediate insulation pattern layer is formed between the conductive pattern layers during the same manufacturing operation, preliminary preventing the need for additional alignment and positioning steps later. This preliminary structuring simplifies the overall multi-layer fabrication process while enabling the resistance-reducing stacked configuration.
4Quantity of substance
If the storage capacitor is formed on the same layer as the wiring, then the storage capacity is sufficient, but the structural complexity increases
Solution Approach 1:
The storage capacitor is merged with the wiring structure by forming both on the same layer using the same conductive pattern layers and intermediate insulation pattern layer. The capacitor electrodes are integrated into the existing wiring layers, allowing the storage function to be added without creating separate dedicated capacitor structures, thus increasing storage capacity while limiting structural complexity.
Data Source
AI summary
An organic light-emitting diode (OLED) display and a method of manufacturing the same are disclosed. In one aspect, the OLED display includes a plurality of pixels, each of the pixels including at least one wiring configured to receive an electrical signal and a storage capacitor formed on the same layer as the wiring. The wiring includes a first conductive pattern layer, an intermediate insulation pattern layer, and a second conductive pattern layer that are sequentially stacked. The first and second conductive pattern layers are electrically connected to each other through a first via hole.


