OLED Wiring Structure with Stacked Conductive Layers

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Solution Overview

Problem

Existing OLED displays face challenges in securing low-resistance wiring and sufficient storage capacity, which affect their performance and manufacturing efficiency.

Innovation Solution

The OLED display design incorporates a wiring structure with a first conductive pattern layer, an intermediate insulation pattern layer, and a second conductive pattern layer stacked sequentially, connected through a via hole, and a storage capacitor formed on the same layer, allowing for low-resistance wiring and sufficient storage capacity. This design includes a planarization layer with a second via hole for contact metal extension and a bridge metal connecting the driving voltage line to the storage capacitor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single-layer wiring structure is used, then the manufacturing process is simple, but the wiring resistance is high

Engineering Contradiction:
Improvewiring structure fabricationVSAvoidwiring resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The wiring is divided into multiple conductive pattern layers (first conductive pattern layer, second conductive pattern layer) stacked vertically and connected via via holes. This segmentation allows current to flow through multiple parallel paths, reducing overall wiring resistance while maintaining manufacturing feasibility through standardized multi-layer deposition processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The wiring structure transitions from a two-dimensional single-layer layout to a three-dimensional multi-layer stacked configuration. By adding the vertical dimension with via holes connecting different layers, the patent reduces resistance without complicating the horizontal manufacturing flow, as each layer is deposited using standard sequential processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If the storage capacitor is formed separately from the wiring, then the wiring structure is simple, but the storage capacity is insufficient

Engineering Contradiction:
Improvewiring and capacitor structureVSAvoidstorage capacity
Core Design Contradiction:
Device complexityVSQuantity of substance

Solution Approach 1:

The storage capacitor is merged with the wiring structure by forming both on the same layer using the same conductive pattern layers and intermediate insulation pattern layer. The capacitor electrodes are integrated into the existing wiring layers, allowing the storage function to be added without creating separate dedicated capacitor structures, thus increasing storage capacity while limiting structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive pattern layers and intermediate insulation pattern layer serve dual functions: they form both the wiring structures and the storage capacitor electrodes. This multi-functionality allows the same manufactured layers to fulfill both signal transmission and energy storage roles, maximizing storage capacity within the existing structural framework.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If multiple conductive pattern layers are stacked, then the wiring resistance is reduced, but the manufacturing process becomes complex

Engineering Contradiction:
Improvewiring resistanceVSAvoidmulti-layer stacking process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The intermediate insulation pattern layer is formed between the conductive pattern layers during the same manufacturing operation, preliminary preventing the need for additional alignment and positioning steps later. This preliminary structuring simplifies the overall multi-layer fabrication process while enabling the resistance-reducing stacked configuration.

Inventive Principle:
Principle #10Preliminary action

4Quantity of substance

If the storage capacitor is formed on the same layer as the wiring, then the storage capacity is sufficient, but the structural complexity increases

Engineering Contradiction:
Improvestorage capacityVSAvoidintegrated structure
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The storage capacitor is merged with the wiring structure by forming both on the same layer using the same conductive pattern layers and intermediate insulation pattern layer. The capacitor electrodes are integrated into the existing wiring layers, allowing the storage function to be added without creating separate dedicated capacitor structures, thus increasing storage capacity while limiting structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9431472B2Organic light-emitting diode (OLED) display and method of manufacturing the same
Publication Date: 2016.08.30 SAMSUNG DISPLAY CO LTD
  • US9431472B2 patent drawing
  • US9431472B2 patent drawing
  • US9431472B2 patent drawing

AI summary

An organic light-emitting diode (OLED) display and a method of manufacturing the same are disclosed. In one aspect, the OLED display includes a plurality of pixels, each of the pixels including at least one wiring configured to receive an electrical signal and a storage capacitor formed on the same layer as the wiring. The wiring includes a first conductive pattern layer, an intermediate insulation pattern layer, and a second conductive pattern layer that are sequentially stacked. The first and second conductive pattern layers are electrically connected to each other through a first via hole.