On-Package Electromagnetic Absorber for EMI Isolation

Solution Overview

Problem

Existing semiconductor technologies face challenges with electromagnetic interference (EMI) and crosstalk in densely packed electronic circuits, leading to signal degradation and component failures, while current shielding methods are bulky, costly, and increase manufacturing complexity.

Innovation Solution

Integration of an on-package electromagnetic absorber using silicon carbide and gold film structures within semiconductor packages to absorb and cancel electromagnetic radiation, designed for frequencies between 50 GHz and 150 GHz, reducing interference and crosstalk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal shields or larger packaging designs are used to improve isolation, then electromagnetic interference and crosstalk are reduced, but the size and weight of electronic devices increase

Engineering Contradiction:

Improveelectromagnetic isolationVSAvoiddevice weight

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The patent changes the material parameter from traditional metal shields to a dielectric material with specific permittivity (e.g., silicon carbide with εr≈26.5 at 100 GHz). This parameter change allows the structure to achieve the same electromagnetic isolation effect through geometric configuration rather than material density, significantly reducing weight while maintaining reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses composite material structures combining dielectric materials (such as silicon carbide) with existing package substrates. This composite approach creates a lightweight electromagnetic isolation structure that leverages the geometric properties of the dielectric material rather than relying on heavy metal shielding, achieving both weight reduction and effective EMI mitigation

Inventive Principle:

Principle #40Composite materials

2Reliability

If metal shields or larger packaging designs are used to improve isolation, then electromagnetic interference and crosstalk are reduced, but the size of electronic devices increases

Engineering Contradiction:

Improveelectromagnetic isolationVSAvoiddevice volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent changes the material parameter from traditional metal shields to a dielectric material with specific permittivity (e.g., silicon carbide with εr≈26.5 at 100 GHz). This parameter change allows the structure to achieve the same electromagnetic isolation effect through geometric configuration rather than material density, significantly reducing weight while maintaining reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses composite material structures combining dielectric materials (such as silicon carbide) with existing package substrates. This composite approach creates a lightweight electromagnetic isolation structure that leverages the geometric properties of the dielectric material rather than relying on heavy metal shielding, achieving both weight reduction and effective EMI mitigation

Inventive Principle:

Principle #40Composite materials

3Reliability

If existing isolation techniques are used, then electromagnetic interference is reduced, but manufacturing complexity and production costs increase

Engineering Contradiction:

Improveelectromagnetic isolationVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the electromagnetic isolation function with the existing package substrate by integrating the dielectric material directly into the packaging structure. This consolidation eliminates the need for separate metal shield components and their associated assembly steps, reducing manufacturing complexity while maintaining effective EMI isolation

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The dielectric material structure serves multiple functions: it provides electromagnetic isolation, maintains mechanical package integrity, and can be integrated with existing substrate fabrication processes. This multi-functionality reduces the need for additional specialized components and manufacturing steps, simplifying production while achieving reliable EMI mitigation

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The absorber technology enhances isolation between semiconductor devices, improving system performance and reliability by mitigating EMI and crosstalk, aligning with compact, lightweight, and cost-effective design goals.

Implementation Method 1

the structure may include a gold film and absorbs electromagnetic radiation emitted from the die during operation of the die

Methodology Applied

Scientific EffectElectromagnetic radiation absorption: Absorption (EM radiation)

Data Source

PatentUS20260068678A1Novel on-package electromagnetic absorber

Publication Date: 2026.03.05 QORVO US INC

AI summary

Aspects of the disclosure provide a semiconductor package and a method for preparing the same. The disclosed semiconductor package includes a die disposed over and conductively coupled to a laminate; and a member (e.g., a lid) attached to the laminate via one or more conducting materials. The member includes a structure (e.g., an electromagnetic absorber structure) configured to absorb electromagnetic radiation. In one or more embodiments, a wireless device may include the semiconductor package produced via the method as disclosed herein.