Opaque Glue Blocking Element for Sensor Crosstalk Reduction
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Solution Overview
Problem
Current packaging methods for proximity and ambient light sensors face challenges in minimizing size, avoiding crosstalk, and maintaining structural integrity due to the use of metal or plastic covers, which are difficult to miniaturize and fix, and the double injection molding process leads to deformation and seams in the transparent molding materials when using high-temperature opaque resins.
Innovation Solution
A packaging structure and method that forms an opaque blocking element by solidifying a liquid opaque glue at room temperature, which is used between the light emitting and sensing elements, eliminating the need for high-temperature processing and providing structural support without deforming the transparent molding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal cover or plastic cover is used as the blocking element, then crosstalk is avoided, but the device size increases and manufacturing difficulty increases due to customized molds
Solution Approach 1:
The patent changes the material parameter from solid metal/plastic covers to liquid opaque resin that can be injected and solidified. This parameter change allows the blocking element to be formed through injection molding rather than requiring customized solid covers, reducing manufacturing complexity while maintaining crosstalk prevention functionality
Solution Approach 2:
The patent uses a disposable opaque resin ingot that is heated, injected, and then discarded after solidification. This approach replaces expensive and complex customized metal/plastic molds with a simpler injection process using consumable resin material, reducing manufacturing difficulty
2Ease of manufacture
If the opaque resin ingot is heated to high temperature to become liquid, then it can be injected to form the blocking element, but the transparent molding materials are softened and misshaped
Solution Approach 1:
The patent changes the temperature parameter of the opaque resin to a lower range that allows it to become injectable liquid without exceeding the glass transition temperature of the transparent molding materials. This parameter adjustment enables injection while preventing softening and misshaping of the transparent materials
Solution Approach 2:
The patent applies partial heating to the opaque resin ingot, heating it only to the extent necessary to achieve liquid state for injection, but deliberately limiting the temperature to avoid excessive heating that would soften the transparent molding materials. This controlled partial action resolves the contradiction between injection capability and shape accuracy
3Ease of manufacture
If the transparent molding materials are softened by high temperature, then the opaque resin can be injected, but the transparent materials become too weak to provide support and seams form
Solution Approach 1:
The patent changes the temperature parameter to remain below the glass transition temperature of the transparent molding materials throughout the injection process. This parameter control maintains the structural strength and rigidity of the transparent materials, preventing them from becoming too weak to provide support while still enabling the injection of opaque resin
Solution Approach 2:
The patent prepares the opaque resin at a controlled temperature beforehand that is sufficient for injection but deliberately kept below the threshold that would soften the transparent molding materials. This prior temperature control cushions against the potential harm of structural weakening, preventing seams from forming during the injection process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces crosstalk between light sensing and emitting elements, allows for miniaturization, and ensures a stable, seamless integration of the blocking element with the transparent materials, enhancing the packaging process's efficiency and accuracy.
Implementation Method 1
forming an opaque blocking element by solidifying a liquid opaque glue at room temperature
Data Source
AI summary
A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.