Opaque Layer Opening for Integrated Optical Sensor Light Path
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices require additional fabrication of optical structures for sensing modules, increasing manufacturing complexity.
Innovation Solution
An electronic device design incorporating a circuit substrate with an inorganic light emitting unit and an opaque layer featuring a first opening for light transmission to an optical sensor, eliminating the need for separate optical structure fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional optical structures are fabricated for sensing modules, then the sensing function is achieved, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the optical sensor with the circuit substrate by directly forming the optical sensor on the substrate, eliminating the need for separate optical structures. The circuit substrate serves dual purposes as both the electronic circuit carrier and the optical sensing platform, thereby simplifying the manufacturing process while maintaining sensing functionality.
Solution Approach 2:
The circuit substrate is designed to perform multiple functions: it serves as the structural base for electronic circuits, the platform for optical sensing, and the integration medium for both components. This multi-functional design eliminates the need for dedicated optical structures, reducing manufacturing complexity while ensuring reliable sensing operation.
2Reliability
If additional optical structures are fabricated for sensing modules, then the sensing function is achieved, but the manufacturing time increases
Solution Approach 1:
By combining the optical sensor fabrication with the circuit substrate manufacturing process, the patent eliminates separate fabrication steps for optical structures. The optical sensor is formed directly on the substrate using the same manufacturing flow as the electronic circuits, significantly reducing total manufacturing time while ensuring functional reliability.
Solution Approach 2:
The optical sensor is formed preliminarily on the circuit substrate during the early stages of manufacturing, before final assembly. This preliminary integration allows subsequent processing steps to proceed without additional optical structure fabrication, thereby reducing overall manufacturing time while maintaining sensing functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process by integrating light transmission directly into the device design, reducing complexity and potentially enhancing light utilization and stray light filtration.
Implementation Method 1
The inorganic light emitting unit is disposed on the circuit substrate and configured to emit a light
Implementation Method 2
A portion of the light is transmitted to the optical sensor through the first opening
Data Source
AI summary
The disclosure provides an electronic device, including: a circuit substrate, an inorganic light emitting unit, and an opaque layer. The circuit substrate includes an optical sensor. The inorganic light emitting unit is disposed on the circuit substrate and is configured to emit a light. The opaque layer is disposed on the circuit substrate, including a first opening through which a portion of the light is transmitted to the optical sensor.