Photocurable Adhesive Bonding for Opaque Substrates
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Solution Overview
Problem
Conventional methods fail to effectively bond and laminate substrates using opaque substrates, as light irradiation cannot penetrate opaque materials, leading to incomplete adhesion and lamination.
Innovation Solution
A method involving printing a photocurable adhesive ink to form a pattern and spacer on a lower substrate, followed by photocuring, and then applying a second adhesive layer, which is partially cured by light irradiation before laminating the upper substrate, allowing for successful bonding even with opaque substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photocurable adhesive ink is applied and cured to bond substrates, then adhesion between substrates is achieved, but light cannot penetrate opaque substrates leading to incomplete curing and bonding failure
Solution Approach 1:
The patent applies preliminary light irradiation to the adhesive layer before substrate lamination to activate the photocurable adhesive in advance. This preliminary action ensures the adhesive is ready to bond immediately upon contact between substrates, eliminating the need for light to penetrate the opaque substrate during the bonding process itself
Solution Approach 2:
The adhesive layer serves as an intermediary medium between the two substrates. By making the adhesive layer itself photocurable and irradiating it with light before lamination, the system transfers the curing function from the substrate-transmitted light path to the adhesive layer directly, allowing opaque substrates to be bonded effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables complete adhesion and lamination of substrates using light irradiation and curing, regardless of substrate transparency, ensuring strong bonding between upper and lower substrates.
Implementation Method 1
printing a first photocurable adhesive ink on a lower substrate to form a pattern; photocuring the pattern to form a spacer on the lower substrate; irradiating the adhesive layer with light
Data Source
AI summary
The present invention relates to a method of bonding substrates and a substrate for displays manufactured by the same. In an embodiment, the method comprises (a) printing a first photocurable adhesive ink on the lower substrate to form a pattern; (b) photocuring the pattern to form a spacer on the lower substrate; (c) printing a second photocurable adhesive ink on the lower substrate, which includes the spacer, to form an adhesive layer; (d) irradiating the adhesive layer with light; and (e) laminating the upper substrate to the lower substrate via the adhesive layer, wherein the upper and lower substrates are transparent or opaque, and wherein the upper and lower substrates comprise the same or different materials.