Lamination Ancillary Operations TRIZ Cases

A peeling head attaches adhesive tape to film edges and overlaps peeled layers to separate coatings sequentially.

A laminating device conveys cleaning sheets orthogonally to the main path for roller maintenance.

Rolling uneven shielding layer punctures adhesive film to establish grounding contact.

Aligned carbon nanotubes embedded in a matrix with phase change layers reduce thermal resistance and thickness limits.

A dual head applicator deposits sealant along a single axis while pivoting around a virtual corner point for various glass sizes.

Tungsten inlays replicate metal card weight using hot lamination, lowering production costs.

An industrial robot positions workpieces against a heated stamping die, resolving versatility limits by adapting to varying geometries without separate devices.

A thin photo-polymerizable positioning guide integrates with an orthodontic bracket to transfer tooth surface geometry for accurate placement.

An elastomer film absorbs thermal expansion stresses between plastic layers, preventing rupture during welding operations.

A thin subject applies shear force to separate a thinned semiconductor wafer from its carrier substrate.

Tiltable dancer rolls adjust substrate tension to prevent wrinkles in web-fed inkjet printing.

Inclined turn over bars redirect fastener material flow between panel webs, resolving width-to-length alignment complexity.

A lifting device for a litho laminating machine uses a spring element and actuator to raise the accelerator table.

A disposable release liner transfers metallic coatings to composite substrates, eliminating vacuum deposition costs while ensuring uniform thickness.

A vacuum lamination machine uses an adjustable stage and identification systems to handle substrates of varying sizes.

Crack initiation at the adhesive layer separates thin semiconductor wafers from carriers, preventing microfractures during debonding.

A die bonder uses a biaxial drive shaft unit to exert precise bonding loads on semiconductor chips.

A vertical film peeling device transfers substrates upright using a vacuum chuck module to maintain orientation during removal.

Roll bonding ductile substrates into perforations of a structural layer improves thermal conductivity while maintaining tensile strength.

A modular label stripping machine uses a sensing unit to detect label length and automatically adjust the guide plate position for precise separation.

Independent servo control aligns plastic flooring layers during rolling, resolving misalignment issues caused by conventional mechanical conveyance systems.

Graphene-reinforced rubber layers on aircraft cargo guide rollers resist cutting and chipping from impact loads.

Stretching the first film before lamination creates shrinkage that maintains a curled lid state without aluminum.

Capillary channels in the bonding layer extract trapped gases, preventing void expansion and ensuring structural stability in vacuum environments.

Segmenting a porous fabric from an oxidized bacterial cellulose film prevents inflammatory exudates from crossing while allowing cell colonization.

An I-shaped manufacturing line reduces installation space while maintaining lamination accuracy and cleanliness control.

A method uses patterned adhesion promoter layers to bond application elements selectively onto substrates.

A thin film polymer structure enables dual-surface modification via a soluble support film exfoliation process.

An anvil wheel apparatus creates balanced layered tapes by overlapping and bonding strips in a specific pattern.

Adjustable measuring shaft maintains constant substrate tape wrap angle, eliminating manual braking torque recalibration during roll diameter changes.

Automated roll changes and pre-stretch systems eliminate wrinkles while boosting production speed.

Joule heating breaks the adhesive bond to prevent flexible substrate damage during high-temperature processing.

A curved display panel manufacturing method separates polarizing plates from glass substrates and reduces their thickness to enable bending.

Epoxysilane-modified acrylic adhesive achieves ice bath resistance without crosslinking agents, enabling quick alkaline removal.

Textured press plates emboss overlay layers to match printed wood patterns, eliminating uniform surface textures that compromise realistic tactile alignment.

Movable base tables and an elastic supporting member apply precise pressure to curved cover plates, preventing air bubbles in large curvature displays.

Light irradiation reduces the adhesive strength of the photosensitive layer to separate the substrate without deformation, improving yield rates.

A floor panel manufacturing method presses a reinforcement sheet between thermoplastic layers to ensure complete fiber impregnation.

An integrated multilayer tray captures exuded liquids using a polyester fiber fabric layer, eliminating separate absorbent pads and simplifying recycling.

Pre-cured adhesive layers enable reliable bonding of opaque substrates by eliminating the need for light penetration through non-transparent materials.

Backup roller winding cures active radiation resin between films to prevent thickness unevenness and wrinkling.

Activation-treated alicyclic olefin resin films bond directly to inorganic layers, eliminating adhesive durability failures under high humidity.

A bonded article joins thin glass to a support substrate using electrostatic adhesion and mechanical pressure without an interlayer.

Laser-based electrostatic charging deposits dry polymer particles onto electrode substrates, eliminating solvent drying steps and reducing production costs.

An adjustable micro device feeder handles varying tape widths by repositioning a drive plate and sprocket, eliminating the need for multiple dedicated units.

An adhesive layer bonds secondary battery separators to electrodes using specific alpha-olefin resins.

A hollow needle device pulls threads through rubber profiles under tension to prevent buckling during embedding.

A laminator adjusts sheet intervals before overlaying film to ensure uniform lamination quality.

A chemically reinforced flexible glass base plate stabilizes brittle wafers during processing, enabling clean separation by bending to prevent breakage.