Vertical Film Peeling Device for OLED Substrates
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Solution Overview
Problem
Conventional film peeling devices for display substrates, such as OLED displays, face issues with non-uniform peeling due to substrate drooping during horizontal peeling, contamination of components by organic materials, and insufficient peeling pressure, leading to uneven peeling and potential pollution.
Innovation Solution
A film peeling device that transfers substrates vertically using a transfer module with front and rear substrate transfer units and a vacuum chuck module to maintain vertical orientation, combined with peeling modules featuring film grippers and rollers to ensure uniform peeling pressure and prevent organic material contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is disposed horizontally during film peeling, then the peeling process can be performed with simple positioning, but the substrate droops due to its weight causing non-uniform film peeling
Solution Approach 1:
The patent inverts the conventional horizontal substrate positioning to a vertical orientation. By standing the substrate vertically during peeling, gravity acts along the peeling direction rather than causing drooping, thereby achieving uniform film removal without requiring complex horizontal positioning mechanisms
Solution Approach 2:
The patent transitions from two-dimensional horizontal substrate handling to three-dimensional vertical positioning. The substrate is oriented perpendicular to the ground, utilizing the vertical dimension to eliminate gravitational distortion and achieve uniform peeling across the entire substrate surface
2Area of stationary object
If wide substrates are used for larger display devices, then the display area is increased, but the substrate weight increases causing greater drooping and non-uniform peeling
Solution Approach 1:
By inverting the substrate orientation to vertical, the patent eliminates the drooping problem that scales with substrate size. Large-area substrates are held perpendicular to gravity, ensuring that even wide substrates maintain uniform tension and achieve consistent film peeling across their entire surface
3Object-affected harmful factors
If the film with organic material is peeled conventionally, then the peeling process can be performed simply, but the organic material falls onto installed components causing pollution
Solution Approach 1:
The patent utilizes vertical substrate orientation to change the trajectory of detached organic material. Instead of falling horizontally onto sensitive components, the organic material is directed downward in a controlled path, away from installed components, thereby preventing contamination while maintaining process simplicity
Solution Approach 2:
The patent separates the organic material removal from the peeling process by allowing it to fall in a predetermined safe direction. The design extracts the harmful element (organic material) from the critical area (installed components) through strategic vertical positioning and controlled detachment
4Manufacturing precision
If conventional peeling pressure is applied to wide substrates, then the peeling can be performed, but insufficient pressure and force are provided resulting in non-uniform peeling rates
Solution Approach 1:
The vertical substrate orientation enables more effective force application during peeling. Pressure can be applied uniformly along the vertical surface, and the peeling force acts in the same vertical direction as gravity, improving the efficiency and uniformity of film removal across wide substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves uniform film peeling with vertical substrate transfer, preventing drooping and contamination, and ensures consistent peeling pressure for uniform film removal, thereby enhancing the peeling process and protecting components from organic material pollution.
Implementation Method 1
a vacuum chuck module for maintaining the substrate to stand in a vertical direction, wherein the vacuum chuck module includes: a frame; a substrate support including an absorbing hole for providing an air suction pressure to the substrate
Data Source
AI summary
A film peeling device for peeling a film from a substrate including a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate, and a peeling module configured to peel the film from the substrate transferred by the transfer module.