Perforated Clad Material for Thermal Conductivity
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Solution Overview
Problem
Existing methods fail to effectively combine materials with high heat transfer properties like copper and aluminum with stainless steel to achieve both substantial thermal conductivity and structural strength in clad materials.
Innovation Solution
A multiple alloy/non-alloy clad material is created through roll bonding a perforated structural substrate with ductile substrates like copper and aluminum, where the ductile material fills perforations in the structural substrate, forming a uniform thickness that allows thermal energy to flow while maintaining structural rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ductile substrate is roll bonded into perforations of structural substrate, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The structural substrate is divided into multiple perforated regions, allowing ductile material to be selectively placed only where thermal conductivity is needed. This segmentation enables the structural substrate to maintain strength while the ductile material provides thermal pathways through the perforations.
Solution Approach 2:
The ductile substrate is nested within the perforations of the structural substrate, creating a multi-layered composite structure. The ductile material fills and bonds to the perforated regions, forming an integrated structure where the softer material is contained within the rigid framework.
2Strength
If high pressure is applied during roll bonding to fill perforations, then bonding strength is improved, but distortion of perforations occurs
Solution Approach 1:
The ductile substrate is pre-formed with a configuration that matches the perforation pattern before the roll bonding process. This preliminary preparation ensures that when pressure is applied during bonding, the ductile material flows into the perforations without causing distortion, as the pre-formed geometry guides the material flow.
3Reliability
If uniform thickness is achieved by filling perforations, then thermal energy flow is improved, but material waste increases
Solution Approach 1:
The ductile material is applied locally only to the perforated regions rather than uniformly across the entire substrate. This localized application provides thermal conductivity enhancement precisely where needed while minimizing material usage and waste, as the ductile material fills only the specific void spaces in the perforations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting material exhibits enhanced thermal conductivity, increased tensile strength, and improved electrostatic discharge properties, making it suitable for applications such as thin heat dissipating devices in electronics.
Implementation Method 1
roll bonding a ductile substrate into perforations within a single structural substrate
Implementation Method 2
the ductile substrate flows into the perforations during roll bonding
Implementation Method 3
allowing thermal energy to flow through the structural member
Data Source
AI summary
Embodiments of the present technology include clad materials. An example clad material includes a perforated structural substrate, a first ductile substrate roll bonded to the perforated structural substrate in such a way that the first ductile substrate at least partially fills the perforations, and a second ductile substrate roll bonded to the first ductile substrate.