Semiconductor Device With Opened Conductive Pads
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Solution Overview
Problem
Conventional semiconductor devices experience delamination issues at interfaces between copper pads and solder material, leading to reduced product yield due to poor bonding.
Innovation Solution
The semiconductor device features conductive elements formed between bonding pads and conductive pads with openings in the pads, allowing increased contact area with the substrate, thereby enhancing bonding strength and reducing delamination, along with a fabrication method that includes forming conductive elements in these openings and encapsulating them with an encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive elements are formed directly on copper pads without openings, then the fabrication process is simple, but bonding is poor and delamination occurs
Solution Approach 1:
The conductive pad is segmented by forming openings within it, dividing the pad surface into multiple regions (openings and remaining pad areas). This segmentation increases the contact area between the conductive element and the pad by allowing the conductive element to wrap around and contact the pad through the opening structure, thereby improving bonding strength while maintaining fabrication feasibility
Solution Approach 2:
The opening structure transforms the bonding interface from a two-dimensional surface contact to a three-dimensional multi-contact structure. The conductive element can contact the pad at multiple points including the opening edges and through the opening, creating a more robust bonding interface that prevents delamination
2Reliability
If openings are formed in conductive pads to increase contact area, then bonding strength is improved, but fabrication complexity increases
Solution Approach 1:
The conductive pad structure is segmented by introducing openings, which divides the pad into multiple functional regions. This segmentation allows the conductive element to establish multiple contact points with the pad, significantly improving bonding strength and preventing delamination while the segmentation pattern can be designed to match the bonding requirements
Solution Approach 2:
The conductive pad is designed with a porous structure (openings) that allows the conductive element to penetrate and contact the pad at multiple locations. This porous configuration increases the effective bonding area and creates mechanical interlocking, enhancing bonding strength without requiring complex additional structures
3Reliability
If more encapsulant is used to protect conductive elements, then protection is improved, but device size and cost increase
Solution Approach 1:
The opening structure in the conductive pad provides inherent mechanical cushioning and stress distribution before the encapsulant is applied. The conductive element bonded through the opening structure has pre-established mechanical interlocking and stress distribution pathways, reducing the need for excessive encapsulant material to provide protection, thereby minimizing device size while maintaining reliability
Solution Approach 2:
The bonding structure combines the conductive pad material, conductive element material, and encapsulant material into a composite structure. The opening configuration allows these materials to work together synergistically, where the conductive element and pad opening structure provide primary mechanical bonding, and the encapsulant provides secondary environmental protection, optimizing the balance between protection and device size
Data Source
AI summary
A semiconductor device is disclosed, which includes: a substrate having a substrate body and a plurality of conductive pads formed on the substrate body, wherein each of the conductive pads has at least an opening formed in a first surface thereof; a semiconductor component having a plurality of bonding pads; a plurality of conductive elements formed between the bonding pads and the conductive pads and in the openings of the conductive pads; and an encapsulant formed between the substrate and the semiconductor component for encapsulating the conductive elements, thereby strengthening the bonding between the conductive elements and the conductive pads and consequently increasing the product yield.