Optical Assembly for Display Devices Using Regular LED Grids
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Solution Overview
Problem
Existing optical assemblies for display devices, such as those using prisms or microlens arrays, often result in image distortions and complex beam guidance due to the dense grouping of light emitting diode chips, limiting their resolution and image quality.
Innovation Solution
An optical assembly comprising multiple chip groups of similar and different wavelength luminescence diode chips, arranged in a regular grid on a carrier, with an optical element that redistributes light to create smaller unit cells with combined wavelengths, reducing the need for color filters and enhancing resolution and contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If prisms or microlens arrays are used for beam guidance, then light can be directed, but image distortions occur and the system becomes complex
Solution Approach 1:
The patent removes the complex prism or microlens array structures from the optical system. Instead, it uses direct light emission from LED chips arranged in specific patterns on a substrate, extracting the beam guidance function from separate optical elements and integrating it into the chip arrangement itself, thereby eliminating image distortions and reducing system complexity
Solution Approach 2:
The patent replaces the mechanical optical system (prisms, microlens arrays) with an electrical/optical integration approach where LED chips are directly mounted on a substrate with conductive patterns. The beam guidance is achieved through the electrical connection patterns and chip arrangement rather than through separate mechanical optical elements, simplifying the overall system
2Productivity
If individual RGB LED chips are used, then color display is achieved, but chip density is limited and resolution is reduced
Solution Approach 1:
The patent combines multiple LED chips (red, green, blue) into integrated chip groups where several chips are mounted together on a single substrate. This merging approach allows multiple color channels to be controlled as a unit, increasing the effective pixel density and display resolution without requiring a proportional increase in the total number of individual chips across the display
3Quantity of substance
If LED chips are densely grouped on a common carrier, then higher density is achieved, but beam guidance becomes complex and limited
Solution Approach 1:
The patent segments the display into multiple independent substrate units, each carrying a group of LED chips. This segmentation allows each substrate to be optimized independently for chip density and electrical connections, avoiding the need for complex beam guidance across a single large carrier. Each substrate acts as an independent module that can be densely packed without creating overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high resolution and improved image quality by combining light from different chip groups into smaller unit cells, reducing the number of required chips and simplifying the manufacturing process while minimizing distortions and reflections.
Implementation Method 1
Each of the chip groups comprises at least two similar luminescence diode chips (21, 22, 31, 32, 41, 42). The luminescence diode chips from one chip group are designed to emit electromagnetic radiation of the same wavelength characteristic.
Implementation Method 2
luminescence diode chips are inorganic, monocrystalline LEDs (light emitting diodes) or organic light-emitting diodes, which are built in thin-film technology on a common substrate as integrated matrices (so-called OLEDs or organic light emitting diodes)
Implementation Method 3
In particular, luminescence diode chips can also be laser diodes, in particular vertical-cavity surface-emitting laser diodes (VCSEL)
Implementation Method 4
An optical element (5) is provided and arranged downstream of the chip groups with respect to the main radiation direction. The optical element is designed to combine light emitted by the luminescence diode chips of the chip groups in second unit cells in an extraction plane
Implementation Method 5
Furthermore, the mask can also be made of a light-absorbing material, which advantageously reduces disturbing reflections on the surface for the observer
Data Source
AI summary
An optical assembly and a display device are disclosed. In an embodiment an optical assembly includes a common carrier, a plurality of first chip groups, each first chip group comprising at least two similar luminescence diode chips, a plurality of second chip groups, each second chip group comprising at least two similar luminescence diode chips, wherein the first and second chip groups are arranged planar along a regular grid of first unit cells on a main surface of the common carrier and an optical element arranged downstream of the first and second chip groups with respect to a main radiation direction, wherein the luminescence diode chips of the different chip groups are configured to emit electromagnetic radiation of different wavelength characteristics.