Optical Board Laser Groove for Cost Reduction
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Solution Overview
Problem
Conventional optical mounting boards require expensive manufacturing equipment due to the use of dies for forming guide grooves and tapered planes, leading to high production costs.
Innovation Solution
An optical board with a substrate having a slit-shaped optical fiber receiving portion and a reflective layer on an inclined plane, formed using a laser to reduce manufacturing costs, where the inclined plane is created by obliquely irradiating a laser beam to expose a strip-shaped portion on the substrate, allowing for the formation of an optical fiber receiving portion without the need for a mold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a die is used to form the guide groove and tapered plane, then the manufacturing precision and quality of the optical board are improved, but the manufacturing cost and equipment complexity increase significantly
Solution Approach 1:
The patent replaces the mechanical die-based forming system with a laser beam system. The laser beam forms the guide groove and inclined plane by melting and evaporating the substrate material directly, eliminating the need for expensive mechanical dies and associated equipment while achieving the required manufacturing precision
Solution Approach 2:
The patent changes the physical state and parameters of the substrate material through laser irradiation. By controlling the laser power, scanning speed, and focal position, the substrate material undergoes phase changes (melting, evaporation) to form the desired groove and inclined plane structures, replacing the mechanical pressure and temperature conditions of die forming
2Manufacturing precision
If a die is used to form the guide groove and tapered plane, then the structural accuracy of the optical board is improved, but the device complexity and equipment requirements increase
Solution Approach 1:
The patent replaces the complex mechanical die system with a laser beam system. The laser beam, controlled by computer programming, directly forms the guide groove and inclined plane by material removal through melting and evaporation, significantly simplifying the equipment structure while maintaining or improving structural accuracy
Solution Approach 2:
The laser beam system is self-contained and does not require separate molding equipment, die replacement mechanisms, or complex mechanical assemblies. The laser directly writes the groove and inclined plane structures into the substrate material, making the system self-sufficient and reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs by eliminating the need for expensive equipment and allows for the formation of thinner optical boards with accurate reflective surfaces, enhancing light reflection and electrical connectivity while maintaining the optical board's functionality.
Implementation Method 1
irradiating laser beam obliquely to the exposed strip-shaped portion, to form an optical fiber receiving portion and an inclined plane at an end of the optical fiber receiving portion
Data Source
AI summary
An optical board including a substrate including a plate-shaped resin including a first main plane and a second main plane facing each other, and a slit-shaped optical fiber receiving portion which penetrates between the first main plane and the second main plane in a thickness direction, a metal layer provided on the second main plane, and a wiring pattern consisting of metal and provided on the first main plane. An inclined plane is provided at an end of the optical fiber receiving portion in the substrate, a tilt angle of the inclined plane with respect to the first main plane is an obtuse angle, and a reflective layer is provided on the inclined plane for reflecting a light output from an optical fiber received in the optical fiber receiving portion toward the first main plane.


