Optical Chip Package with Conductive Pillars and Soft Board

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Solution Overview

Problem

Conventional optical chip package structures are bulky and costly due to the need for a frame to support the glass board and prevent bonding wire compression, limiting their ability to fit into smaller spaces.

Innovation Solution

A package structure using a soft board with conductive pillars for direct electrical connection to the optical chip, eliminating the need for wire bonding and a frame, and incorporating a transparent protection sheet for the chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a frame is used to support the glass board and prevent bonding wire compression, then the reliability of the package structure is improved, but the volume and material cost increase

Engineering Contradiction:

Improveprotection of bonding wireVSAvoidpackage structure volume

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent removes the frame component from the package structure entirely. Instead of using a frame to support the glass board and protect bonding wires, the invention directly bonds the glass board to the substrate, eliminating the need for a frame and thereby reducing package volume and material cost while maintaining structural integrity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the glass board directly with the substrate through bonding, combining functions that were previously separated by the frame structure. This direct bonding approach integrates the support and protection functions into the bonding interface itself, eliminating the need for additional protective components.

Inventive Principle:

Principle #5Merging (Combining)

2Stability of the object's composition

If a frame is used to maintain predetermined distance between glass board and optical chip, then the structural stability is improved, but the device complexity and cost increase

Engineering Contradiction:

Improvestructural stabilityVSAvoidpackage structure complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent extracts and removes the frame component from the package structure. The predetermined distance and structural stability previously maintained by the frame are achieved through direct bonding of the glass board to the substrate, simplifying the overall structure while maintaining stability.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The bonding interface serves multiple functions simultaneously: it provides structural support, maintains predetermined distances, and ensures structural stability, replacing the multiple functions that were previously distributed across the frame, glass board support, and spacing mechanisms.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If wire bonding is used to electrically connect contact pad and solder pad, then the electrical connectivity is achieved, but the manufacturing cost and process complexity increase

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical wire bonding process with a direct bonding approach. Instead of using bonding wires to connect contact pads to solder pads, the invention uses direct bonding technology that eliminates the need for wire bonding, thereby reducing manufacturing cost and process complexity while maintaining electrical connectivity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Strength

If a hard board is used as the substrate, then the structural support is improved, but the adaptability to fit smaller spaces is reduced

Engineering Contradiction:

Improvesubstrate support strengthVSAvoidflexibility for smaller space

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent replaces the hard board substrate with a flexible substrate that can be bent or conformally shaped. This flexible substrate maintains sufficient structural support for the package components while enabling the package to fit into smaller or non-standard spaces, thereby improving adaptability without sacrificing necessary structural integrity.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS7560744B2Package optical chip with conductive pillars

Publication Date: 2009.07.14 ADVANCED SEMICON ENG INC

AI summary

A package structure and a fabricating method thereof are provided. The package structure includes a soft board and an optical chip. The soft board has a surface with a bump disposed thereon. The optical chip includes a main body and a conductive pillar. The main body has an active surface and a non-active surface opposite to the active surface. The active surface has a sensing area and a contact pad electrically connected with each other. The non-active surface is attached to the surface. The conductive pillar is disposed inside the main body, and penetrates the active surface and the non-active surface. The conductive pillar has a first end electrically connected to the contact pad and a second end electrically connected to the bump.