Optical Chip Package Assembly With Self-Aligning Cover Optics
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Solution Overview
Problem
Existing electronic housing designs for chips on carrier wafers face challenges in precise and efficient assembly, particularly in aligning optical components and ensuring proper light transmission, which affects the accuracy and functionality of optical interfaces.
Innovation Solution
The design incorporates an optical element with a central light-deviating region and positioning pattern on a base wafer, mounted on an encapsulation cover with a recessed cavity system for adhesive fixation, allowing precise alignment and secure mounting of the optical element over the chip's optical component, ensuring a common optical axis for correct alignment and light transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional mounting methods are used for optical components, then assembly is simpler, but alignment precision and light transmission are suboptimal
Solution Approach 1:
The optical element is pre-mounted on the encapsulation cover with positioning patterns and alignment marks prepared in advance. The recessed cavity system is pre-formed on the encapsulation cover to receive the optical element. This preliminary preparation enables precise alignment when the encapsulation cover is mounted on the carrier substrate, resolving the contradiction between alignment precision and assembly complexity.
Solution Approach 2:
The encapsulation cover serves as an intermediary component between the carrier substrate and the optical element. It integrates the recessed cavity system, positioning patterns, and alignment marks to facilitate precise mounting of the optical element while simplifying the overall assembly process. This intermediary structure enables high-precision alignment without requiring complex external alignment equipment.
2Reliability
If precise alignment methods are implemented, then light transmission is optimized, but assembly time and complexity increase
Solution Approach 1:
The positioning patterns and alignment marks on the optical element and encapsulation cover enable self-alignment during assembly. The optical element automatically positions itself correctly within the recessed cavity system without requiring external alignment equipment or complex adjustment procedures. This self-aligning mechanism optimizes light transmission while maintaining fast assembly speed.
Solution Approach 2:
Alignment marks and positioning patterns are pre-formed on the optical element and encapsulation cover during manufacturing. This preliminary preparation ensures that when assembly occurs, the components can be quickly aligned using these pre-established reference features, eliminating time-consuming alignment procedures while ensuring optimal light transmission paths.
3Strength
If optical elements are securely fixed, then chip protection is enhanced, but assembly precision requirements increase
Solution Approach 1:
The recessed cavity system creates localized mounting regions on the encapsulation cover where the optical element is secured. The adhesive is applied specifically within these recessed cavities, concentrating the fixation strength at precise locations. This local quality approach ensures secure fixation of the optical element while maintaining tolerance for variations in overall mounting precision through the self-aligning positioning patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates precise assembly and secure mounting of optical elements, ensuring accurate alignment and efficient light transmission, enhancing the functionality and reliability of electronic devices by maintaining a common optical axis and providing ventilation channels for the chamber.
Implementation Method 1
a back layer 22, in particular having a central region 19 designed to deviate the light
Data Source
AI summary
An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.