Optical Coupler Reflective Structure for Broadband Wafer Testing

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Solution Overview

Problem

The wavelength selectivity of grating couplers in silicon photonic devices limits their bandwidth, making it difficult to achieve broadband testing in wafer-level testing of optical transceivers.

Innovation Solution

The method involves forming a light reflective structure with an inclined reflective surface on the photonic structure, allowing for a change from vertical coupling to edge coupling, which increases the bandwidth of the optical coupler and enables broadband testing by exposing the coupling surface of the optical coupler and forming a rib portion with a mirror-like inclined surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a grating coupler is used for vertical coupling, then wafer-level testing can be accomplished, but the wavelength selectivity significantly limits the bandwidth

Engineering Contradiction:

Improvewafer-level testing capabilityVSAvoidbandwidth

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent inverts the conventional vertical coupling approach by implementing edge coupling through lateral surfaces of the photonic structure. This inversion eliminates the wavelength selectivity limitation of grating couplers while maintaining wafer-level testing capability, thereby resolving the contradiction between ease of manufacture and bandwidth adaptability

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions from vertical coupling (one-dimensional optical path) to edge coupling by utilizing the lateral dimension of the photonic structure. This dimensional change enables broadband operation while preserving the wafer-level testing advantage, effectively resolving the technical contradiction

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If vertical coupling is used with grating coupler, then the structure is simple, but broadband testing is difficult to achieve

Engineering Contradiction:

Improvecoupling structureVSAvoidbroadband testing capability

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

By inverting the coupling approach from vertical to edge coupling, the patent achieves broadband testing capability without significantly increasing device complexity. The edge coupling structure maintains simplicity while eliminating the wavelength selectivity constraint that prevents broadband operation

Inventive Principle:

Principle #13The other way round (Inversion)

3Adaptability or versatility

If edge coupling is implemented to increase bandwidth, then broadband testing is enabled, but the coupling method changes from vertical to edge

Engineering Contradiction:

ImprovebandwidthVSAvoidcoupling method

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent utilizes the lateral dimension of the photonic structure to implement edge coupling, enabling broadband testing while maintaining ease of manufacture through wafer-level processing. This dimensional approach allows broadband operation without sacrificing manufacturing simplicity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the bandwidth of the optical coupler, allowing for broadband testing by modifying the optical path from vertical to edge coupling, thereby improving the light coupling efficiency and testing capabilities.

Implementation Method 1

forming a light reflective structure with an inclined reflective surface on the photonic structure to change the optical path from vertical coupling to edge coupling

Methodology Applied

Scientific EffectReflection: Reflection

Data Source

PatentUS20230387334A1Method for manufacturing integrated circuit device and integrated circuit device thereof

Publication Date: 2023.11.30 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method for manufacturing an integrated circuit device is provided. The method includes: providing a photonic structure including an insulating structure and an optical coupler embedded in the insulating structure; and removing a portion of the insulating structure to expose a coupling surface of the optical coupler and form a light reflective structure corresponding to the coupling surface.