Optical Coupling for Multi-Layer Document Circuits
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Solution Overview
Problem
Existing document technologies face challenges in creating a cost-effective and compact electronic device with multiple circuit levels that are electrically isolated for applications such as ID cards, passports, and RFID tags, while maintaining mechanical stability and security against manipulation.
Innovation Solution
The integration of electronic components across multiple circuit levels using optical coupling for energy and data transmission, eliminating the need for vias and plated-through holes, with a document body containing barium titanate pigments to enhance dielectric properties and a layered structure for secure and flexible functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If vias and plated-through holes are used to couple circuit levels, then electrical connection between levels is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes vias and plated-through holes from the circuit level coupling structure, replacing vertical electrical connections with optical coupling between circuit levels. This extraction of problematic elements simplifies manufacturing by eliminating complex drilling, plating, and alignment processes required for via formation.
Solution Approach 2:
The patent replaces the mechanical/electrical connection method (vias and plated holes) with an optical coupling system. Light signals transmit data and power between circuit levels without physical electrical contact, substituting a complex electrical interconnection structure with a simpler optical transmission medium.
2Adaptability or versatility
If multiple circuit levels are integrated vertically, then device functionality is enhanced, but mechanical stability and resistance to manipulation decrease
Solution Approach 1:
The patent transitions from a tightly stacked vertical arrangement to a more distributed three-dimensional configuration where circuit levels are coupled optically. This spatial reorganization maintains functional integration while reducing mechanical vulnerability, as optical coupling allows for greater separation and flexibility in layer positioning.
Solution Approach 2:
The patent introduces an optical intermediary (light transmission medium) between circuit levels, replacing direct electrical contact. This intermediary layer acts as a buffer that maintains signal transmission while reducing direct mechanical and electrical coupling, thereby enhancing security against physical manipulation and tampering.
3Ease of manufacture
If optical coupling is used between circuit levels, then manufacturing is simplified and costs reduced, but energy transmission efficiency may be affected
Solution Approach 1:
The patent optimizes optical coupling parameters including light wavelength, intensity, and transmission medium properties to maximize energy transfer efficiency. By carefully selecting and tuning these parameters, the system achieves effective power and data transmission through optical channels while maintaining manufacturing simplicity and cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a compact, secure, and flexible electronic device with enhanced integration and functionality, preventing manipulation and interference, while simplifying manufacturing and reducing costs by eliminating complex vertical contacting and vias.
Implementation Method 1
the components of the electronic device, which are arranged in different circuit levels, are optically coupled for energy and/or data transmission
Implementation Method 2
the material of the document body can contain pigments which lead to an increase in the relative dielectric constant. This can be, for example, barium titanate pigments
Implementation Method 3
A radio frequency identification (RFID) tag with an inductively coupled antenna is known from WO 2006/019587 A1. The antenna is coupled to an integrated circuit wirelessly via a coil
Data Source
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AI summary
The invention relates to a document having an document body (148) and an electronic device integrated in the document body, wherein the electronic device has a plurality of components (110, 122, 124, 126) which are arranged distributed in the document in a plurality of circuit planes (102, 104, 106, 108), the components of different circuit planes being isolated galvanically from one another.