Optical Device Heat Dissipation via Segmented Substrate

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Solution Overview

Problem

Optical devices, particularly light-emitting chips, face challenges with heat dissipation and short circuits during packaging, leading to reliability issues and decreased efficiency.

Innovation Solution

A surface-emitting optical device with a substrate featuring conductive bulks, penetrating insulation members, and conductive layers, connected by conductive wires, allowing for easy heat dissipation and series, parallel, or series-parallel connections of light-emitting chips without additional wiring layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a light emitting chip is packaged to form a device, then the device can be used in display areas, but heat dissipation becomes difficult and short circuits may occur between electrodes

Engineering Contradiction:

Improveusage in display areasVSAvoidshort circuit prevention

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The substrate is divided into multiple isolated conductive regions (first conductive region, second conductive region, third conductive region) separated by insulation layers. This segmentation prevents short circuits between electrodes while allowing independent electrical connections to multiple light emitting chips, enabling versatile display configurations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Insulation layers are introduced as intermediary elements between conductive regions and between conductive regions and light emitting chips. These insulation layers act as mediators that prevent direct electrical contact (avoiding short circuits) while still allowing thermal contact for heat dissipation, thus improving reliability without sacrificing adaptability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If additional wiring layers are added to connect light emitting chips, then series, parallel, or series-parallel connections can be achieved, but the device complexity increases

Engineering Contradiction:

Improveconnection configurationsVSAvoidwiring layer structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The conductive regions on the substrate serve multiple functions: they act as electrical connection points for light emitting chips, provide heat dissipation paths, and enable various connection configurations (series, parallel, series-parallel) without requiring separate wiring layers. This multi-functionality achieves connection versatility while maintaining structural simplicity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the functions of substrate, wiring layer, and heat dissipation structure into a single integrated substrate design. The conductive regions perform both electrical connection and thermal management functions, eliminating the need for additional wiring layers and reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Device complexity

If heat from the light emitting chip is not dissipated, then the device structure can be simplified, but the risk of device breaking and degradation increases

Engineering Contradiction:

Improvestructure simplicityVSAvoiddevice breaking risk

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The substrate incorporates localized heat dissipation structures (conductive regions with specific thermal properties) at critical areas where light emitting chips are mounted. These regions have optimized thermal conductivity to efficiently conduct heat away from the chips, while the rest of the substrate maintains structural simplicity. This local optimization ensures reliable heat dissipation without complicating the overall device structure.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables effective heat dissipation and reliable connections of light-emitting chips, enhancing the optical device's performance and preventing short circuits, thus improving the device's efficiency and reliability.

Implementation Method 1

allows heat generated from a light emitting chip to be easily dissipated

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The plurality of light emitting chips are attached to the at least one conductive layer by means of a conductive adhesive

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8921879B2Optical device and method for manufacturing same

Publication Date: 2014.12.30 POINT ENG

AI summary

The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.