Optical Die Nanostructures for Wafer-Level Photonic Alignment
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Solution Overview
Problem
Integration of multiple semiconductor devices in wafer-level packaging poses challenges due to the complexity of aligning and stacking optical components, which can lead to manufacturing inefficiencies and increased costs.
Innovation Solution
The integration of optical nanostructures within an optical die that can perform optical transformations on incident radiation, allowing for simplified alignment and reduced component count by embedding optical functions directly in the semiconductor device, thereby streamlining the manufacturing process and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are integrated in wafer-level packaging with separate optical components, then optical functionality is achieved, but manufacturing complexity and alignment difficulty increase
Solution Approach 1:
The patent combines optical components and semiconductor devices into a single integrated wafer-level package, merging previously separate alignment steps into one simultaneous process. The optical components are positioned and secured to the semiconductor devices while still on the wafer, eliminating subsequent alignment operations and reducing manufacturing complexity.
Solution Approach 2:
The wafer-level packaging process serves multiple functions simultaneously: it provides mechanical support, establishes electrical connections, positions optical components, and secures all elements in their final configurations. This multi-functional approach replaces multiple separate manufacturing steps with a single integrated process.
2Adaptability or versatility
If optical components are aligned and stacked at wafer level, then integration is achieved, but manufacturing efficiency decreases
Solution Approach 1:
The patent performs alignment and positioning of optical components while the semiconductor devices are still on the wafer, before the wafer is diced into individual devices. This preliminary action allows all alignment operations to be completed in bulk, avoiding the need for time-consuming individual device assembly later.
Solution Approach 2:
Multiple manufacturing operations including alignment, positioning, and securing of optical components are merged into a single wafer-level processing step, enabling parallel production across multiple devices simultaneously and significantly improving manufacturing efficiency.
3Adaptability or versatility
If separate optical components are used, then optical effects are achieved, but component count and costs increase
Solution Approach 1:
The patent integrates optical components directly with semiconductor devices in a single package, reducing the total component count by eliminating the need for separate mounting and connection elements. This consolidation maintains all necessary optical effects while reducing the number of discrete parts required.
Solution Approach 2:
The integrated wafer-level package performs multiple functions simultaneously, providing both semiconductor device functionality and optical component functionality within a single structure, thereby reducing the overall component count and associated costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the flexibility and efficiency of semiconductor device manufacturing by enabling multiple optical effects with a single array of optical nanostructures, reducing production complexity and costs while maintaining performance.
Implementation Method 1
optical nanostructures formed in an optically active area of the optical die. The nanostructures are positioned and shaped so that an optical transformation is performed on incident radiation of a predetermined wavelength
Implementation Method 2
enabling multiple optical effects with a single array of optical nanostructures
Data Source
AI summary
A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupler to receive radiation of predetermined wavelength incident on the grating coupler. The optical die is disposed over the photonic die and includes a substrate with optical nanostructures. Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located. The optical nanostructures overlie the grating coupler so that the incident radiation of predetermined wavelength crosses the optical die where the optical nanostructures are located before reaching the grating coupler.