Optical Die Recess Substrate for High-Speed Signal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of opto-electric circuitry with electrical circuitry in multi-chip modules requires precise alignment, which is difficult to maintain and increases manufacturing complexity and costs, especially at high data rates beyond 20 Gbps.
Innovation Solution
An integrated circuit package design featuring a substrate with a recess to house an optical unit that reflects optical signals emitted by opto-electric circuitry away from the substrate and incident signals onto the circuitry, reducing alignment precision needs and eliminating the need for light guides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If opto-electric circuitry is integrated with electrical circuitry in multi-chip modules, then high data rate communications are achieved, but alignment precision requirements increase and manufacturing complexity increases
Solution Approach 1:
A substrate is introduced as an intermediary component between the optical die and the electrical circuitry. The substrate provides a stable mounting platform with integrated optical pathways and coupling mechanisms, enabling the optical die to be positioned and aligned more easily while maintaining high data rate communication performance.
Solution Approach 2:
The system is divided into separate functional modules: an optical die containing opto-electric circuitry, an electrical circuitry die, and a substrate that mediates their interaction. This segmentation allows each component to be optimized and manufactured independently, then assembled with reduced precision requirements compared to direct integration.
2Productivity
If opto-electric circuitry is integrated with electrical circuitry in multi-chip modules, then high data rate communications are achieved, but device complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for mounting the optical die, guides optical signals from the optical die to external interfaces, and facilitates electrical connections. This multi-functionality reduces the overall device complexity by consolidating several components into a single element.
Solution Approach 2:
The substrate acts as a mediator that simplifies the interface between optical and electrical domains, providing standardized mounting interfaces and optical coupling mechanisms that reduce manufacturing complexity while enabling high data rate communications.
3Ease of operation
If light guides are used to transmit optical signals, then optical signal transmission is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent eliminates the need for separate light guide components by integrating optical signal transmission functionality directly into the substrate structure. The substrate itself provides the optical pathways and coupling interfaces, removing the complexity associated with adding separate light guide elements to the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies manufacturing, reduces costs, and allows for high-speed operation by enabling compact integration of optical and electrical components without the need for precise alignment or light guides, thus meeting high data rate requirements.
Implementation Method 1
optical signals emitted by the opto-electric circuitry are reflected away from the substrate and incident optical signals are reflected onto the opto-electric circuitry
Data Source
AI summary
An integrated circuit package includes a substrate having a recess formed along at least a portion of a perimeter of the substrate, and an optical die having opto-electric circuitry, the optical die coupled to the substrate such that a portion of the optical die with the opto-electric circuitry overhangs the recess. The integrated circuit package also includes an optical unit disposed in the recess such that optical signals emitted by the opto-electric circuitry are reflected away from the substrate and incident optical signals are reflected onto the opto-electric circuitry.