Optical Die Transfer Alignment for Higher Throughput
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Solution Overview
Problem
The high inertial mass associated with traditional laser die transfer systems limits the throughput of electronic components, as it requires significant movement of both the source and target substrates, making it difficult to achieve efficient alignment and transfer of components.
Innovation Solution
An electronic component transfer system utilizing an optical light source with a movable drive unit and controller to align and release components, reducing the inertial mass by moving the light source and light beam instead of the substrates, allowing for faster alignment and increased throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional laser die transfer systems move both source and target substrates to align components, then alignment can be achieved, but the high inertial mass limits the throughput
Solution Approach 1:
The patent replaces the mechanical movement of heavy substrates with an optical system. A movable optical light source can be rapidly positioned to different locations on the source substrate without the inertia constraints of moving the entire substrate assembly. This substitution of mechanical substrate movement with optical beam positioning directly resolves the contradiction between throughput and inertial mass.
Solution Approach 2:
The patent introduces dynamic positioning of the optical light source, allowing rapid adjustment of the light beam position to track components as the source substrate moves at high speed. This dynamic optical positioning system enables the alignment function to be achieved without moving the heavy substrate, thereby increasing throughput while avoiding inertial mass limitations.
2Manufacturing precision
If the source substrate and target substrate are mutually moved for alignment, then component alignment with target positions is achieved, but the time required for acceleration and movement reduces throughput
Solution Approach 1:
The patent replaces time-consuming mechanical substrate movement with rapid optical positioning. The movable optical light source can be repositioned between components much faster than substrates can be accelerated and moved, thereby achieving the same alignment function with significantly reduced time loss.
Solution Approach 2:
The system pre-calculates the positions where the optical light source needs to be located for each component to be transferred. By planning the optical positioning path in advance, the system minimizes the time required for alignment operations while maintaining precision.
3Productivity
If heavy source carrier and target carrier are moved repeatedly for component transfer, then components can be arranged on target substrate, but the high inertial mass limits the number of components that can be transferred per unit time
Solution Approach 1:
The patent replaces the mechanical movement of heavy carriers with a movable optical light source. The optical system can rapidly reposition between components without being constrained by the mass of the carriers, enabling a higher rate of component transfer per unit time.
Solution Approach 2:
The movable optical light source serves multiple functions: it can position itself to release components from different locations on the source substrate, transfer them to different target positions, and do so rapidly without the limitations of carrier movement. This universal positioning capability increases the components per unit time throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more efficient alignment of components, improving the transfer throughput by minimizing the time required to bring components into alignment with empty target positions, thus overcoming the limitations of traditional systems.
Implementation Method 1
a source substrate 220 is in the form of a semiconductor wafer that consists of singulated semiconductor dies 221 mounted on a foil 222 using an adhesive 223... The adhesive or attaching action of the adhesive of attaching agent can be terminated using light from the optical light source. For example, the adhesive or attaching agent can be heated by the light such that it loses its adhesive or attachment properties. As an example, the adhesive or attaching agent can at least be partially ablated causing the electronic component to be propelled away from the source substrate.
Data Source
Figure 1A~1B
Figure 2
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AI summary
Aspects of the present disclosure relate to an electronic component transfer system. Further aspects of the present disclosure relate to a method for transferring an electronic component. The present disclosure particularly relates to electronic component transfer systems in which an optical light source is used for releasing and transferring electronic components. According to an aspect of the present disclosure, a drive unit is used for moving the optical light source and/or light beam output by the optical light source to change a position at which it has released a component from the source substrate to a position at which it will release a next component from the source substrate.