Optical Ejector Lens for Damage-Free Die Detachment
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Solution Overview
Problem
Conventional ejector systems face challenges in detaching small and thin electronic elements from adhesive tapes without causing damage or deformation, due to limitations in material thickness and increased stress on the die, leading to issues like pin marks and cracking.
Innovation Solution
An ejector unit with a movable lens that irradiates the adhesive carrier with a light source to weaken the adhesive force, combined with a vacuum pump and a pick tool, allows for gentle peeling of the electronic element, reducing the risk of damage and stress on the element during detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a multi-plates ejector system is used to detach small and thin electronic elements, then the adhesive force can be overcome, but the plates become too thin causing abrasion and unreliable movement
Solution Approach 1:
The patent replaces the mechanical multi-plates ejector system with a light source and ejector lens system. The light source irradiates the adhesive carrier through the lens to weaken the adhesive force, eliminating the need for thin mechanical plates that suffer from abrasion and friction issues. This substitution of mechanical action with optical action resolves the reliability problem of thin plate movement.
Solution Approach 2:
The patent changes the physical state of the adhesive carrier by irradiating it with light, which weakens the adhesive force. This parameter change (from strong adhesive state to weakened adhesive state) allows for easier detachment of the electronic element without requiring excessive mechanical force that would damage thin plates.
2Force
If ejector pins are used to detach the electronic element, then the adhesive force can be overcome, but local stress causes pin marks and cracking on the die
Solution Approach 1:
The patent replaces the mechanical ejector pins system with a light source and ejector lens system. Instead of using pins that concentrate force and cause local stress, the light irradiates the adhesive carrier to weaken the adhesive force uniformly. This eliminates the harmful local stress that causes pin marks and cracking on thin electronic elements.
Solution Approach 2:
The patent introduces light as an intermediary between the ejector lens and the adhesive carrier. The light acts as a mediator that weakens the adhesive force without requiring direct mechanical contact with the electronic element, thereby avoiding the pin marks and cracking caused by direct pin contact.
3Volume of moving object
If the die thickness is reduced to meet high density requirements, then the electronic package density increases, but the die becomes more susceptible to damage during detachment
Solution Approach 1:
The patent replaces mechanical ejection systems with an optical system that weakens adhesive force through light irradiation. This allows thin dies (e.g., 76.2 μm or 3 mil and less) to be detached without the mechanical stress and local concentration of force that would cause damage, thereby enabling high density packages while maintaining die integrity.
Solution Approach 2:
The patent changes the adhesive force parameter by irradiating the adhesive carrier with light, which weakens the bond between the die and the carrier. This parameter change allows thin dies to be detached with minimal force, preventing damage while achieving the required high package density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient and damage-free detachment of small and thin electronic elements from adhesive carriers, minimizing pin marks and cracking, and effectively addressing the limitations of prior art systems.
Implementation Method 1
the ejector lens is movable relative to the supporting deck along the optical axis to project the protruding face through the opening of the supporting deck against the electronic element for lighting the electronic element
Implementation Method 2
The ejector unit can irradiate the adhesive carrier through the ejector lens and the opening in the supporting deck so as to lower or weaken the adhesive force of the adhesive carrier
Implementation Method 3
a pick tool, operable to hold the electronic element via a vacuum suction force
Implementation Method 4
the vacuum pump being operable to generate a vacuum suction force that is sufficient to peel the adhesive carrier away from the electronic element
Data Source
AI summary
An ejector unit for detaching an electronic element from an adhesive carrier has an ejector housing with a supporting deck, a light source disposed therein and an ejector lens. The ejector lens has a protruding face. The ejector lens is disposed and oriented with an optical axis extending between the light source and an opening in the supporting deck, and the protruding face of the lens directed towards the opening. The ejector lens is movable relative to the supporting deck along the optical axis to project the protruding face through the opening against the electronic element for lifting the electronic element.