Optical Element Asymmetric Electrode Noise Reduction
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Solution Overview
Problem
Current optical communication devices face challenges in efficiently transmitting high-frequency signals due to radiated noise and limited design flexibility, particularly in the connection and positioning of optical elements and their driving parts, which affects reliability and signal integrity.
Innovation Solution
A multi-channel optical element and package substrate design featuring external and dummy electrodes with symmetrical bumps, connected through conductor circuits of equal length, allowing for flip chip bonding or wire bonding, and an optical path with a collective or individual through hole structure, enhancing signal transmission reliability and reducing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external electrodes are formed on one main surface of the optical element, then connection to driving parts is enabled, but radiated noise increases and signal integrity deteriorates in high-frequency transmission
Solution Approach 1:
The patent applies asymmetry by forming external electrodes only in a first region of the optical element's main surface, while leaving the second region electrode-free. This asymmetric electrode distribution reduces radiated noise in high-frequency signal transmission compared to conventional symmetric electrode arrangements, while still enabling adequate connection to driving parts through the positioned external electrodes.
2Adaptability or versatility
If optical elements and driving parts are connected through conductor circuits, then electrical connection is established, but design flexibility is limited and wiring becomes complex
Solution Approach 1:
The patent extracts the connection function from complex internal wiring by forming external electrodes directly on the optical element's surface. This allows driving parts to be connected externally through simplified conductor circuits, reducing internal wiring complexity and increasing design flexibility for mounting and connection arrangements.
3Manufacturing precision
If optical elements are mounted on package substrate, then optical communication function is achieved, but positioning precision and connection reliability are affected
Solution Approach 1:
The patent applies preliminary action by pre-forming external electrodes at specific positions on the optical element before mounting. This allows the optical element to be positioned and connected to the package substrate with higher precision, as the external electrodes serve as predetermined connection points that guide accurate alignment and improve connection reliability.
Data Source
AI summary
An optical element of the present invention comprises: one or a plurality of unit elements having a plurality of external electrodes formed on one main surface thereof, wherein upon taking the one main surface of the unit elements in a plan view, the plurality of external electrodes are locally formed in a first region of two regions of a planar shape of the main surface, the two region formed by equally dividing the planar shape with a center line.