Light-Transmitting Optical Element Structure for LED Crosstalk Shielding
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Solution Overview
Problem
Conventional semiconductor light emitting devices face issues with light leakage and crosstalk due to the peeling or cracking of coating films on side surfaces, especially under thermal stress, which affects reliability and light shielding performance.
Innovation Solution
A semiconductor light emitting device design featuring a light-transmitting optical element with a light shielding film on its side surface, an annular frame covering the peripheral edge, and an adhesive layer that adheres the optical element to a wiring substrate, preventing light leakage and enhancing reliability without a separate cover member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a coating film is provided on the side surface of the light emitting element or wavelength conversion member, then light shielding characteristics are improved, but the coating film may peel off or crack due to thermal stress during mounting or usage
Solution Approach 1:
The patent extracts the light shielding function from a separate coating film and integrates it into the wavelength conversion member itself by forming a light shielding film on the side surface of the wavelength conversion member. This eliminates the need for a separate coating film that would peel or crack, while maintaining effective light shielding between adjacent light emitting elements
Solution Approach 2:
The patent merges the wavelength conversion member and light shielding structure into a single integrated component. The light shielding film is formed directly on the side surface of the wavelength conversion member, combining the functions of wavelength conversion and light shielding into one structural unit, thereby eliminating the reliability issues of separate coating films
2Productivity
If multiple light emitting devices are arranged close to each other to increase output, then productivity and light output are improved, but light leakage and crosstalk between adjacent devices occur
Solution Approach 1:
The patent applies local quality by providing light shielding specifically at the side surfaces of individual wavelength conversion members where light leakage occurs, rather than using a uniform shielding structure throughout. The light shielding film is selectively positioned on the side surfaces to block crosstalk between adjacent devices while maintaining high device density
Solution Approach 2:
The patent segments the light shielding function to each individual wavelength conversion member by forming separate light shielding films on their side surfaces. This segmented approach allows each device to independently control its own light leakage, enabling high-density arrangement without crosstalk interference
3Object-affected harmful factors
If a separate cover member is added to prevent light leakage, then light shielding is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the light shielding function into the existing wavelength conversion member structure by forming a light shielding film on its side surface. This integration eliminates the need for a separate cover member, reducing device complexity and manufacturing steps while maintaining effective light shielding
Solution Approach 2:
The wavelength conversion member is given multiple functions: it performs wavelength conversion and simultaneously provides light shielding through the film on its side surface. This multi-functionality eliminates the need for separate components, simplifying the overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields emitted light, suppresses crosstalk between adjacent devices, and ensures high reliability by preventing light leakage and protecting the light-emitting functional layer, allowing for close and reliable mounting of multiple devices.
Implementation Method 1
a light-transmitting optical element having a light shielding film provided on a side surface of a plate-shaped light-transmitting optical body
Implementation Method 2
an adhesive layer configured to adhere the light-transmitting optical element to an upper surface of the wiring substrate
Data Source
AI summary
A semiconductor light emitting device includes: a wiring substrate on which a p-electrode and an n-electrode are provided on a substrate; a light-emitting functional layer including a p-type semiconductor layer and an n-type semiconductor layer connected to the p-electrode and the n-electrode, respectively, and bonded onto the wiring substrate; a light-transmitting optical element having a light shielding film provided on a side surface of a plate-shaped light-transmitting optical body and which has an annular frame portion that covers a peripheral edge portion of a back surface of the light-transmitting optical body and formed on the peripheral edge portion; and an adhesive layer configured to adhere the light-transmitting optical element to an upper surface of the wiring substrate such that the light-emitting functional layer is inserted into a recessed portion inside the frame portion. The recessed portion is filled with the adhesive layer.