Metallic Optical Separation Grid Brazing for LED Matrices
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Solution Overview
Problem
Current methods for producing optical separation grids for photo-emitting and photo-receiving devices, especially those emitting or receiving light from the rear face, face challenges in achieving good alignment and require material planarization, which complicates the process and limits the height of the optical separation grid.
Innovation Solution
A method involving the production of a metallic optical separation grid by securing it using brazing, where a metallic electrode covers the semiconductor stack and the grid is aligned through self-alignment during the soldering process, eliminating the need for material planarization and allowing for precise alignment with the device components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the optical separation grid is produced by depositing material in trenches formed by lithography, then the grid can be integrated during BEOL manufacturing, but the height of the grid is limited to between 1 μm and 3 μm
Solution Approach 1:
The production process is divided into two independent stages: first producing the optical separation grid on a separate support substrate, then transferring it to the device. This segmentation allows each stage to be optimized independently, enabling greater grid height without compromising integration capability
Solution Approach 2:
The optical separation grid is produced in advance on a support substrate before being transferred to the final device. This preliminary action allows the grid to be manufactured with optimal dimensions and properties, then positioned precisely during the device assembly process
2Adaptability or versatility
If the optical separation grid is produced after substrate removal for rear-face devices, then it can be applied to rear-face emission/reception, but alignment with pixels becomes difficult
Solution Approach 1:
A support substrate acts as an intermediary carrier during the production and transfer process. The grid is first fabricated on this intermediate support, then transferred to the final device with precise alignment, enabling both rear-face applicability and manufacturing precision
Solution Approach 2:
The alignment process uses optical fields and electromagnetic methods instead of purely mechanical alignment techniques. Optical alignment methods enable precise positioning of the grid relative to pixels during the transfer process
3Ease of manufacture
If material planarization is performed to form the optical separation grid, then the grid can be integrated with interconnection levels, but the production process becomes more complex
Solution Approach 1:
The optical separation grid production is extracted from the main device fabrication process and performed separately on a support substrate. This extraction eliminates the need for material planarization steps in the device process while maintaining integration capability through subsequent transfer
4Area of stationary object
If the walls of the optical separation grid are made thin to preserve pixel surface, then the aspect ratio becomes large (greater than 2), making manufacturing difficult
Solution Approach 1:
The deposition process is designed to be self-aligning, where the material automatically conforms to the desired wall geometry during deposition. This self-service mechanism produces walls with excellent verticality and surface finish without requiring complex post-processing or planarization steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise alignment and secure attachment of the optical separation grid without the need for planarization, improving the optical isolation and directivity of the device while simplifying the production process, suitable for high-resolution devices like LED matrices.
Implementation Method 1
securing the metallic optical separation grid against said face of the first metallic electrode by brazing
Implementation Method 2
The light-emitting and/or light-receiving component may comprise at least one light-emitting and/or light-receiving diode
Implementation Method 3
treatment of at least one face of the first metallic electrode located at the level of the transmitting and/or receiving face, making said face of the first metallic electrode wettable
Data Source
Figure 1~2
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AI summary
Method for making a photo-emitter and/or photo-receiver device (100) with a metallic optical separation grid (140), comprising at least: - making at least one photo-emitter and/or photo-receiver component (102), in which at least one first metallic electrode (110) of the photo-emitter and/or photo-receiver component covers lateral sides of at least one semiconductor stack (104, 106, 108) of the photo-emitter and/or photo-receiver component and extends to at least one emitting and/or receiving face (112) of the photo-emitter and/or photo-receiver component; - treating at least one face of the first metallic electrode located at the level of the emitting and/or receiving face, making said face of the first metallic electrode wettable; - making the metallic optical separation grid on at least one support (142);- securing the metallic optical separation grid to the face of the first metallic electrode by brazing; - removal of the support.