Optical IC Packaging With Laminated Dielectric Carrier
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices with light-emitting and/or light-receiving IC chips require complex manufacturing and mounting operations, leading to inefficiencies and increased costs.
Innovation Solution
A thin electronic device design featuring an opaque dielectric carrier and confinement substrate with laminated layers, including a solid back layer and a front frame that delimits cavities for IC chips, along with transparent encapsulation blocks and light-filtering particles, which simplifies the manufacturing process and reduces device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional mounting operations are used for IC chips with optical elements, then optical functionality is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the carrier substrate and encapsulation cover into a single integrated component. The carrier substrate includes integrated optical elements (LEDs, photodetectors) that are directly mounted on the substrate, eliminating the need for separate mounting operations for IC chips. This merging of functions reduces the number of manufacturing steps while maintaining optical functionality.
Solution Approach 2:
The carrier substrate serves multiple functions simultaneously: it provides mechanical support, electrical connections, optical emission/detection, and encapsulation. The integrated optical elements on the substrate eliminate the need for separate IC chip mounting, making the substrate a universal component that performs multiple roles in the final device.
2Length of moving object
If IC chips are mounted with spacing on carrier substrate, then optical elements are accessible, but device thickness increases
Solution Approach 1:
The patent transitions from a traditional planar mounting approach to a three-dimensional integrated structure. Optical elements are embedded within the carrier substrate itself, utilizing the vertical dimension of the substrate thickness rather than requiring lateral spacing. This allows optical functionality to be maintained while reducing overall device thickness.
3Ease of manufacture
If encapsulation cover with openings is used, then optical elements are exposed, but manufacturing operations increase
Solution Approach 1:
The encapsulation cover and carrier substrate are merged into a single integrated component. The optical elements are directly integrated on the carrier substrate, eliminating the need for a separate encapsulation cover with openings. This reduces the number of manufacturing operations while ensuring proper optical element exposure and protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a more efficient and cost-effective manufacturing process, enabling the production of thin electronic devices with integrated optical elements while maintaining optical functionality, specifically suitable for thin IC chips.
Implementation Method 1
The encapsulation blocks may include light-filtering particles
Data Source
AI summary
An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on either side of the intermediate partition. Electronic integrated circuit (IC) chips are located inside the cavities and mounted on top of the solid back layer. Each IC chip includes an integrated optical element. Electrical connections are provided between the IC chips and back electrical contacts of the solid back layer. Transparent encapsulation blocks are molded in the cavities to embed the IC chips.