Optical IC Interconnect Layout With MicroLEDs and Waveguide Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chip-to-chip interconnects face limitations in density and power dissipation due to fundamental constraints of electrical interconnects, which hinder the performance of high-performance computing and networking systems, while optical interconnects offer potential solutions but are challenging to integrate with standard technology.
Innovation Solution
The integration of optical components into integrated circuits, including a semiconductor substrate with transistors, alternating metal and dielectric interconnect layers, microLEDs, and photodetectors, with light passageways and waveguides to enable high-speed optical interconnects that bypass the limitations of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrical interconnects are used for chip-to-chip connections, then integration with standard technology is achieved, but interconnect density and power dissipation performance are fundamentally limited
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects, substituting the electrical field-based signal transmission mechanism with light-based transmission. This fundamental substitution eliminates the resistive and capacitive losses inherent in electrical interconnects, achieving ultra-low power dissipation while maintaining high integration through monolithic fabrication of photonic integrated circuits that can be combined with electronic circuits using techniques like heterogeneous integration and co-packaging.
2Loss of energy
If optical interconnects are implemented, then power consumption and latency are reduced, but integration with standard technology becomes challenging
Solution Approach 1:
The patent merges optical and electronic functionalities into a single integrated platform through photonic integrated circuits (PICs) that can be monolithically fabricated or heterogeneously integrated with electronic circuits. Techniques include co-fabrication of photonic and electronic components on the same substrate, heterogeneous integration of separate photonic and electronic chips, and co-packaging approaches that bring optical transceivers close to electronic circuits, thereby achieving seamless integration with standard technology while maintaining low power consumption.
Solution Approach 2:
The patent creates universal photonic integrated circuit platforms that can serve multiple functions and be integrated with various standard technologies. The PIC platform provides multi-functional capabilities including light generation, modulation, detection, and signal processing, while being compatible with standard fabrication processes and able to interface with different electronic circuit architectures,从而实现 broad applicability and ease of integration.
3Quantity of substance
If chip-to-chip connections are made with higher density, then interconnect capacity increases, but power dissipation per bit increases for electrical interconnects
Solution Approach 1:
The patent substitutes optical transmission for electrical transmission in high-density interconnect scenarios. Optical signals experience minimal attenuation and no resistive heating, allowing extremely high interconnect densities with proportionally low power consumption per bit. The optical interconnects maintain signal integrity over longer distances without requiring repeaters, further reducing overall system power while increasing capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables dense parallel optical chip-to-chip interconnects that significantly reduce latency and power consumption, overcoming the limitations of electrical interconnects and enhancing system performance in high-performance computing and networking.
Implementation Method 1
a microLED on a pad on the stack of interconnect layers, with at least one electrical connection coupling the pad and at least one transistor of the semiconductor substrate
Implementation Method 2
a photodetector integrated in the semiconductor substrate, with a light passageway to the photodetector through the stack of interconnect layers
Implementation Method 3
a first waveguide on the stack of interconnect layers, the first waveguide extending over the light passageway to the photodetector through the stack of interconnect layers
Data Source
AI summary
Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.