Optical Interconnect Assembly With Embedded Waveguides for Dense I/O
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Solution Overview
Problem
Current board-level optical interconnect solutions are inefficient in terms of area and power due to the use of discrete electronic and photonics dies with separate fiber cables, which do not effectively support high bandwidth requirements in data centers.
Innovation Solution
Integration of electronic and photonics dies with a substrate and socket layer to enable waveguide formation and fiber connectivity, utilizing micro-lenses and waveguides for efficient optical coupling, reducing area and power consumption while supporting bandwidths over 100 Gb/sec.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete electronic dies and discrete photonics dies are assembled on a PCB with separate fiber cables, then the system can be manufactured using conventional discrete assembly processes, but the area consumption and power usage are excessive
Solution Approach 1:
The patent merges discrete electronic dies and photonics dies into integrated electronic-photonic modules where electronic components and photonic components are combined on the same substrate or closely coupled packages. This integration reduces the total board area by eliminating separate discrete assemblies and their interconnections, while maintaining manufacturability through standardized module fabrication processes
Solution Approach 2:
The patent implements nested structures where photonics dies are integrated within or adjacent to electronic die packages, creating hierarchical integration. The photonic components are positioned in proximity to electronic components, with optical interconnects nested within the same package footprint, thereby reducing overall area consumption while preserving discrete assembly capabilities
2Ease of manufacture
If discrete electronic dies and discrete photonics dies are assembled on a PCB with separate fiber cables, then the system can be manufactured using conventional discrete assembly processes, but the power consumption is excessive
Solution Approach 1:
The patent combines electronic and photonic functions into integrated modules that reduce power consumption by minimizing electrical-to-optical conversion stages. The integrated architecture allows direct coupling between electronic drivers and photonic modulators, eliminating intermediate discrete components that contribute to power loss, while maintaining compatibility with conventional manufacturing processes
Solution Approach 2:
The patent introduces integrated optical interconnect structures that serve as intermediaries between electronic dies and external fiber networks. These integrated optical interfaces reduce power consumption by providing optimized electrical-optical conversion pathways compared to discrete assemblies, while maintaining manufacturability through standardized integration techniques
3Productivity
If large SERDES blocks are used to drive data in the server system, then the data transmission capability is sufficient, but the area and power efficiency deteriorate
Solution Approach 1:
The patent segments the functions of large SERDES blocks into distributed electronic-photonic integration across multiple smaller dies. Instead of concentrating all serialization/deserialization functions in single large blocks, the system distributes these functions across integrated modules, reducing the area required per functional unit while maintaining total data transmission capability through parallel optical channels
4Productivity
If large SERDES blocks are used to drive data in the server system, then the data transmission capability is sufficient, but the power efficiency deteriorates
Solution Approach 1:
The patent divides large SERDES functionality into segmented electronic-photonic integrated modules that achieve data transmission through optimized optical pathways. This segmentation reduces power consumption by eliminating redundant electrical signaling stages present in conventional large SERDES blocks, while maintaining data transmission capability through parallel optical channels with lower power requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration facilitates high bandwidth communications through optical interconnects, such as silicon waveguides, reducing area and power usage while enabling efficient data transfers.
Implementation Method 1
a photonics die positioned between the first portion of the electronic die and the substrate and configured to generate a light signal
Implementation Method 2
at least one first micro-lens formed beneath the photonics die... at least one second micro-lens formed on top of the board... wherein the at least one first micro-lens and the at least one second micro-lens are optically coupled via at least one hole formed in the substrate and the socket
Implementation Method 3
at least one waveguide formed in the socket or board
Data Source
AI summary
Disclosed are apparatus and methods for optical interconnections that include the integration of a photonics die (pDie) and an electronic die (eDie) with a socket layer, waveguides and fiber connectors to enable high bandwidth communications. In one embodiment, an exemplary optical interconnect device includes an electronic die coupled to a photonics die and integrated with a substrate, a socket, a board, a pair of micro-lenses and a mirror coupled to a waveguide, which can be embedded in the board. In another embodiment, the waveguide is embedded in a socket layer and coupled to a fiber connector. In these embodiments, the exemplary optical interface device can be coupled one more other optical interconnect devices via a waveguide array and/or a fiber array.