Optical Interposer Mirror Structure for Efficient Edge Coupling
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Solution Overview
Problem
Existing optical and electrical signal processing devices face challenges in efficiently integrating long-range optical components with short-range electrical components, particularly in terms of signal conversion and processing, leading to inefficiencies in signal transmission and processing.
Innovation Solution
The integration of a silicon photonics die using a compact universal photonic engine (COUPE) structure with a metal reflector and edge coupler, which combines a support substrate with a mirror coating to reflect light into and out of a waveguide, allowing for improved signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a grating coupler is used for light coupling, then the device structure is simpler, but the signal transfer efficiency is lower
Solution Approach 1:
The patent introduces an edge coupler as an intermediary component between the waveguide and external optical components. This edge coupler acts as a mediator that enables more efficient light coupling compared to direct grating coupling, while maintaining a relatively compact and integrable structure within the photonic device.
Solution Approach 2:
The patent modifies the coupling parameters by transitioning from grating-based coupling to edge-based coupling. This involves changing the coupling mechanism, orientation, and geometric parameters of the coupling interface, thereby improving signal transfer efficiency while managing structural complexity through optimized design parameters.
2Productivity
If long-range optical components and short-range electrical components are integrated, then signal transmission capability is improved, but device complexity increases
Solution Approach 1:
The patent merges optical and electrical signal processing functions within a single integrated photonic device. The silicon photonics die combines waveguides for optical signal transmission with electronic components for signal processing, enabling both long-range optical communication and short-range electrical processing in one unified structure.
Solution Approach 2:
The silicon photonics die is designed with multi-functionality, serving both as an optical waveguide for long-range signal transmission and as an electrical signal processing platform. This universal structure eliminates the need for separate optical and electrical devices, managing integration complexity through a consolidated design.
3Productivity
If a mirror coating is added to reflect light into and out of the waveguide, then signal transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The mirror coating is applied during the manufacturing process as a preliminary step before waveguide formation or integration. By pre-coating the substrate with reflective material, the subsequent waveguide fabrication and assembly processes are simplified, and the overall manufacturing complexity is managed through structured process sequencing.
Solution Approach 2:
The device employs composite material structures, combining the mirror coating material (such as metal or dielectric layers) with the silicon photonics waveguide material. This composite approach enables efficient light reflection and waveguide integration, achieving improved signal transfer while managing manufacturing complexity through established composite material fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances signal transfer by utilizing an edge coupler instead of a grating coupler, resulting in better signal processing and transmission efficiency between optical and electrical components.
Implementation Method 1
a metal reflector and edge coupler, which combines a support substrate with a mirror coating to reflect light into and out of a waveguide
Data Source
AI summary
Optical devices and methods of manufacture are presented in which a mirror structure is utilized with an optical interposer. In embodiments a method patterns a substrate to form a recess with a sidewall, forms a mirror coating on the sidewall, deposits and patterns a material to form a first waveguide adjacent to the mirror coating, and bonds an optical interposer over the first waveguide.