Optical Interposer Memory Architecture for Scalable High-Bandwidth I/O
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Solution Overview
Problem
Existing memory macro structures face challenges in scaling up memory capacity due to increasing I/O numbers and complexity in IC processing and manufacturing, particularly in optical data communication systems, where reliable and efficient mechanisms for transmitting and detecting laser light are needed.
Innovation Solution
An integrated circuit structure is developed with an optical interposer that integrates memory devices and optical links, allowing for efficient communication through optical interconnects, including waveguides and photonic IC chips, enabling high-speed data transfer and signal integrity by converting optical signals to electrical signals and vice versa, while using a unified memory I/O chip for different types of memory.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory capacity is scaled up by increasing I/O ports, then memory capacity increases, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent replaces traditional electrical I/O interconnects with optical interconnects using waveguides and photonic components. This substitution enables higher bandwidth and scalability without proportionally increasing physical I/O port complexity, as optical signals can carry more data through fewer channels while reducing electrical interference and signal integrity issues that plague scaled electrical interconnects.
Solution Approach 2:
The patent introduces optical interconnects as a new dimension of data transmission alongside traditional electrical I/O. By adding this optical layer, the system achieves higher memory capacity and bandwidth without linearly increasing the complexity of the electrical I/O subsystem, effectively decoupling capacity scaling from electrical interconnect complexity.
2Area of moving object
If geometry size is decreased to increase functional density, then production efficiency increases, but processing and manufacturing complexity increases
Solution Approach 1:
The patent segments the memory system into separate photonic and electronic functional blocks that can be independently fabricated and then integrated. This segmentation allows each subsystem to be optimized and manufactured using appropriate processes, reducing overall manufacturing complexity despite small geometry sizes, as the photonic and electronic portions can be processed separately before final assembly.
3Speed
If optical interconnects are used to transfer signals, then data transfer speed increases, but signal detection and transmission reliability becomes more challenging
Solution Approach 1:
The patent employs photodetectors and optical-to-electrical conversion interfaces as intermediary components between the optical waveguides and the electronic memory circuits. These intermediaries translate optical signals into electrical signals that can be reliably processed by standard electronic circuits, maintaining high data transfer speeds while solving the detection and reliability challenges through proven photonic-electronic interface technologies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure enhances memory capacity and bandwidth, supports high-performance computing, and enables efficient data transfer in optical data networks by reducing optical path length and improving signal integrity, suitable for applications in data centers and artificial intelligence.
Implementation Method 1
an optical interposer 102 having optical waveguides 318
Implementation Method 2
converting optical signals to electrical signals and vice versa
Data Source
AI summary
The present disclosure provides an integrated circuit (IC) structure. The IC structure includes an optical interposer having optical waveguides; a plurality of chip stacks disposed over the optical interposer, each of the plurality of chip stacks including a first photonic IC chip and a memory chip over the first photonic IC chip; and a plurality of first laser source chips disposed adjacent to the plurality of chip stacks, respectively, wherein the optical waveguides in the optical interposer are configured as an optical interconnect structure to couple with the memory chip through the first photonic IC chip.