Optical Interposer Structure for Multi-Level Photonic Signal Switching
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Solution Overview
Problem
Current photonic components face challenges in packaging multiple components at different elevations and communicating effectively among them, necessitating an improved optoelectronic package structure that enables efficient optical signal transmission and switching between various photonic components.
Innovation Solution
The proposed optoelectronic package structure incorporates an optical interposer with multiple optical paths and coupling regions, allowing for the selective optical coupling of photonic components at different elevations, enabling efficient switching and transmission of optical signals between them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple photonic components are packaged at different elevations, then packaging density and integration are improved, but packaging complexity and alignment difficulty increase
Solution Approach 1:
The patent transitions from traditional planar packaging to three-dimensional vertical packaging by stacking photonic components at different elevations. The optical interposer provides vertical optical coupling between components on different layers, enabling high-density integration while managing the complexity through standardized vertical interfaces and alignment structures.
Solution Approach 2:
The optical interposer serves as an intermediary component that facilitates optical coupling between photonic components at different elevations. It provides a standardized interface layer with optical waveguides that simplify the complex task of direct vertical alignment and coupling between stacked components, thereby reducing packaging complexity while maintaining high density.
2Reliability
If optical coupling is established between photonic components, then signal transmission efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The optical interposer is pre-configured with optical waveguides and coupling structures before final assembly. This preliminary preparation of optical paths and coupling interfaces allows for more relaxed alignment tolerances during final component stacking, as the interposer already contains the precise optical routing needed for efficient signal transmission.
Solution Approach 2:
The patent employs parameter changes in the optical coupling mechanism, such as adjusting numerical aperture, waveguide dimensions, and coupling region characteristics, to optimize signal transmission while accommodating manufacturing variations. These parameter optimizations enable efficient optical coupling with reduced precision requirements.
3Volume of moving object
If electronic components are embedded within photonic components, then package size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent implements nesting by embedding electronic components within or alongside photonic components in a hierarchical arrangement. The optical interposer provides the structural framework that accommodates both photonic and electronic components in integrated positions, enabling space-efficient nesting while managing manufacturing complexity through modular assembly processes.
Solution Approach 2:
The patent merges photonic and electronic components into a unified package structure where both component types coexist and interact through the optical interposer. This consolidation reduces overall package size by eliminating separate packaging requirements, while the modular design of the interposer helps manage the increased manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances packaging flexibility, improves yield, and reduces the overall size of the optoelectronic package by allowing optical couplings between various photonic components, while also embedding electronic components within photonic components to minimize the thickness of the optical interposer and the package structure.
Implementation Method 1
The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.
Implementation Method 2
The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.
Implementation Method 3
The optical interposer is configured to receive an optical signal from the first photonic component and switch between a first coupling region at the first surface and a second coupling region at the second surface to output the optical signal.
Data Source
AI summary
An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component and an optical interposer. The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.