Optical Interposer Packaging for Planar Photonic-Electrical Integration
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical components efficiently for signal transmission and processing, particularly in forming devices that combine long-range optical components with short-range electrical components, leading to inefficiencies in signal conversion and processing.
Innovation Solution
The development of an optical interposer that integrates optical and electrical components through a silicon-on-insulator substrate, using dielectric and semiconductor materials, with metallization layers and bonding processes to create a photonic integrated circuit (PIC) that facilitates efficient signal conversion and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical and electrical components are integrated in separate packages, then each component can be optimized independently, but the overall device complexity and signal conversion inefficiency increase
Solution Approach 1:
The patent merges optical and electrical components into a single integrated package structure. The electrical package substrate and optical package substrate are bonded together to form a unified device, eliminating the need for separate packages and external signal conversion interfaces. This integration reduces signal loss and improves transmission efficiency while maintaining manageable complexity through systematic design.
Solution Approach 2:
The patent introduces an intermediary bonding interface between the electrical and optical package substrates. This bonding layer acts as a mediator that enables direct physical and functional connection between electrical components (such as antennas) and optical components (such as modulators), facilitating efficient signal conversion without requiring external conversion devices.
2Length of moving object
If optical components are used for long-range transmission, then transmission distance is improved, but the need for electrical components for short-range processing increases device complexity
Solution Approach 1:
The integrated package structure serves multiple functions simultaneously: it provides long-range optical transmission capabilities while also incorporating short-range electrical processing components. The unified design allows the same device to handle both transmission distance requirements and signal processing needs, eliminating the need for separate specialized components.
Solution Approach 2:
The patent segments the device into distinct electrical and optical substrate regions that are bonded together. This segmentation allows each region to be optimized for its specific function (electrical for short-range processing, optical for long-range transmission) while maintaining overall integration. The modular segmented structure manages complexity by organizing different functional components in dedicated zones.
Data Source
AI summary
Optical devices and methods of manufacture are presented in which a protective layer is formed over a support substrate, a first semiconductor die, and an optical interposer. The optical interposer is encapsulated with an encapsulant with a second semiconductor die. The encapsulant is planarized with the second semiconductor die, and the encapsulant is removed to expose the protective layer after the planarizing the encapsulant.