Optical Interposer Packaging With Planar Protective Layer
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical components efficiently for signal transmission and processing, particularly in forming devices that combine long-range optical components with short-range electrical components for seamless conversion and processing.
Innovation Solution
A method is developed for manufacturing an optical interposer that includes a silicon-on-insulator substrate with patterned optical components, metallization layers, and semiconductor devices, utilizing dielectric-to-dielectric and metal-to-metal bonding processes to integrate optical and electrical components, and a protective layer for planar surface formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical components are integrated in the same device, then signal transmission efficiency is improved, but device complexity increases
Solution Approach 1:
The device is divided into separate optical components (waveguides, optical sources, detectors) and electrical components (electrodes, interconnects, processing circuits) that are integrated on the same substrate but function independently. This segmentation allows each component to be optimized for its specific function while maintaining overall system efficiency.
Solution Approach 2:
Optical and electrical components are merged into a single integrated device package, enabling seamless signal conversion and processing between optical and electrical domains. The integration occurs on a common substrate with shared structural elements, reducing overall system complexity despite the multifunctional nature of the device.
2Manufacturing precision
If protective layer is added over optical components, then surface planarity is improved, but manufacturing steps increase
Solution Approach 1:
The protective layer is deposited conformally over the optical components before subsequent processing steps. This preliminary protection ensures surface planarity is established early in the manufacturing process, preventing damage to delicate optical structures during later fabrication steps and reducing the need for additional planarization operations.
Data Source
AI summary
Optical devices and methods of manufacture are presented in which a protective layer is formed over a support substrate, a first semiconductor die, and an optical interposer. The optical interposer is encapsulated with an encapsulant with a second semiconductor die. The encapsulant is planarized with the second semiconductor die, and the encapsulant is removed to expose the protective layer after the planarizing the encapsulant.