Optical Modulation Image Chip for Compact Spectral Recognition
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Solution Overview
Problem
Conventional imaging spectrometers are bulky, heavy, and fail to meet the requirements for miniaturization and lightweight, especially in applications like small satellites and unmanned aerial vehicles, due to their complex optical systems and limited spatial resolution.
Innovation Solution
An image collection chip with an optical modulation layer, an image sensing layer, and pixel confirmation modules that include modulation units and sensing units, where the modulation units have modulation holes arranged in a specific two-dimensional pattern, allowing for light modulation and intensity sensing without the need for gratings or prisms, reducing device volume and improving precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional imaging spectrometers are used, then spectral detection capability is achieved, but device volume and weight increase
Solution Approach 1:
The patent combines the optical modulation function and image sensing function into a single integrated chip structure. The optical modulation layer with patterned holes is directly formed on the image sensing layer, merging what would traditionally be separate optical components (gratings, prisms, beam splitters) and sensors into one compact unit. This integration eliminates the need for complex external optical systems while maintaining spectral detection capability.
Solution Approach 2:
The patent replaces mechanical optical components (gratings, prisms, mirrors, beam splitters) with a micro-fabricated optical modulation layer featuring patterned holes. Instead of using mechanical dispersion elements to separate wavelengths, the invention uses precisely engineered hole patterns that optically modulate light to achieve spectral separation and detection, thereby eliminating bulky mechanical optical systems.
2Measurement precision
If conventional imaging spectrometers are used, then spectral detection is achieved, but device complexity increases
Solution Approach 1:
The patent merges multiple optical functions (beam splitting, wavelength dispersion, and detection) into a single integrated chip with an optical modulation layer and image sensing layer. This consolidation eliminates the need for multiple separate optical components and their associated alignment mechanisms, significantly reducing system complexity while maintaining spectral detection capability.
Solution Approach 2:
The invention replaces complex mechanical optical systems with a micro-fabricated structure where patterned holes in the optical modulation layer perform wavelength separation and modulation. This substitution eliminates the need for mechanically adjustable components, complex mounting structures, and precise alignment mechanisms, thereby reducing device complexity.
3Measurement precision
If conventional imaging spectrometers are used, then spectral imaging is achieved, but device weight increases
Solution Approach 1:
The patent combines optical modulation and image sensing into a single integrated chip, eliminating the need for separate optical components that would add weight. The optical modulation layer with patterned holes is directly formed on the image sensing layer, creating a lightweight monolithic structure that performs both spectral modulation and detection functions.
Solution Approach 2:
The invention replaces heavy mechanical optical components (gratings, prisms, mirrors) with a lightweight micro-fabricated optical modulation layer. The patterned holes in this layer provide the necessary optical modulation for spectral imaging without requiring bulky mechanical structures, thereby significantly reducing device weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The image collection chip achieves accurate image reconstruction with high measurement accuracy, portability, real-time detection, and low manufacturing costs, while enhancing spectral recognition rates and reducing mis-recognition, making it suitable for applications on small platforms.
Implementation Method 1
each modulation unit is provided with at least one modulation subunit, and each of the modulation subunits is provided with several modulation holes penetrating into the optical modulation layer; the respective modulation holes inside a same modulation subunit are arranged into a two-dimensional graphic structure having a specific pattern
Implementation Method 2
the modulation holes are arranged into a two-dimensional graphic structure having a specific pattern
Implementation Method 3
each set of the pixel confirmation modules includes modulation units and sensing units; each modulation unit and each sensing unit are correspondingly provided up and down on the optical modulation layer and the image sensing layer, respectively
Data Source
AI summary
An image collection chip, an object imaging recognition device and an object imaging recognition method are provided. The image collection chip comprises an optical modulation layer and an image sensing layer. The optical modulation layer is located on the image sensing layer. The optical modulation layer is provided with at least two modulation units and the image sensing layer is provided with sensing units corresponding to the at least two modulation units in a form of up and down. Each of the at least two modulation units is provided with at least one modulation subunit. Two or more modulation units among the at least two modulation units have different graphic structures, and the two or more modulation units having different graphic structures have different modulation roles on spectrum.