Optical Module Block with Feedthrough Pins for Dual-Sided Mounting
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Solution Overview
Problem
Conventional small-sized optical modules with CAN-type packages face challenges in mounting large die area electronic devices and miniaturization, as well as electrical connection between devices mounted on both side surfaces, which affects mechanical and electrical reliability.
Innovation Solution
The optical module features a stem and cap design with a block having first and second surfaces for mounting optical and electrical devices respectively, utilizing feedthrough pins for electrical connection between them, eliminating the need for auxiliary members and enhancing mounting area and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional block with single-sided mounting surface is used, then the structure is simple, but the mounting area for electronic devices is limited and large die area devices cannot be mounted
Solution Approach 1:
The block structure transitions from single-sided mounting to dual-sided mounting by utilizing both the first surface and second surface for device mounting. This dimensional expansion of the mounting interface allows electronic devices with large die areas to be mounted while maintaining a compact package size.
2Area of stationary object
If devices are mounted on both side surfaces of the block, then the mounting area is expanded, but electrical connection between devices becomes difficult
Solution Approach 1:
Feedthrough pins are introduced as intermediary elements that pass through the block to establish electrical connections between devices mounted on the first surface and devices mounted on the second surface. These pins provide reliable electrical pathways without requiring external auxiliary members, thus maintaining connection reliability while enabling dual-sided mounting.
3Reliability
If auxiliary members are used to detour the block for electrical connection, then electrical connection is achieved, but mechanical and electrical reliability is degraded
Solution Approach 1:
The feedthrough pins are integrated directly into the block structure, merging the electrical connection function with the mechanical support structure. This eliminates the need for separate auxiliary members that would detour around the block, thereby improving both mechanical and electrical reliability while reducing overall device complexity.
4Volume of moving object
If the package is miniaturized, then the module size is reduced, but the mounting area for large die area devices is insufficient
Solution Approach 1:
By utilizing both the first surface and second surface of the block for device mounting, the effective mounting area is doubled without increasing the package volume. This dual-sided mounting approach enables compact package miniaturization while providing sufficient mounting area for electronic devices with large die areas.
Data Source
AI summary
The present invention provides an optical module with a relatively wider mounting area for the devices with a CAN package. The optical module of the present invention provides the stem and the cap, both of which form a cavity where the devices are to be installed. The stem provides the block extruding from the primary surface of the stem into the cavity. The block mounts the optical and electrical devices in surfaces opposite to each other, and provides feedthrough pins between these two surfaces. The device mounted in each surface may be electrically connected through these feedthrough pins.