Optical Module Heat Dissipation via Piezoelectric Fan and Cross-Structured Sink
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Solution Overview
Problem
Existing heat dissipation systems for optical modules suffer from inefficient heat dissipation due to heat accumulation, leading to excessive temperatures and potential damage, especially when multiple modules are mounted on the same plane, as they rely on heat sinks that do not adequately address the issue of heat distribution and dissipation.
Innovation Solution
A heat dissipation system comprising a circuit card with a first heat dissipation apparatus, a piezoelectric film fan, and a cross-structured heat sink fin, where the piezoelectric film fan enhances airflow through a hollow body and nozzle configuration, and a second heat sink apparatus is strategically placed on the optical module's housing to improve heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple optical modules are disposed on the same plane and heat is dissipated by using a heat sink, then the heat sink makes temperatures of the optical modules even and equal, but heat accumulation phenomenon still exists and heat dissipation effect is not desirable
Solution Approach 1:
The patent introduces a vertical heat dissipation dimension by placing heat dissipation holes through the substrate thickness direction, allowing heat to escape upward rather than only laterally through heat sinks. This dimensional change creates additional heat dissipation pathways that prevent heat accumulation while maintaining temperature uniformity across modules.
Solution Approach 2:
The substrate is divided into multiple functional layers including first and second heat dissipation holes at different depths, with reflective layers strategically positioned at specific depths. This segmentation allows different regions to handle heat dissipation differently, with shallow holes for immediate heat release and deep holes for sustained heat extraction, improving overall heat dissipation effectiveness.
2Temperature
If heat is dissipated by using a heat sink covering all optical modules, then temperatures become even and equal, but heat accumulation still occurs causing optical modules to be easily damaged
Solution Approach 1:
Reflective layers are introduced as intermediary elements positioned at specific depths within the substrate. These reflective layers redirect heat flow upward toward the heat dissipation holes, preventing heat from accumulating in the lower regions. The reflective layers act as mediators that redirect thermal energy toward effective dissipation pathways, reducing heat accumulation damage while maintaining even temperature distribution.
Solution Approach 2:
The substrate incorporates heat dissipation holes creating a porous structure that allows heat to escape through the substrate thickness. This porous architecture provides multiple heat dissipation channels distributed throughout the substrate volume, enabling heat to be extracted efficiently from deep within the module structure, thereby preventing heat accumulation damage.
3Ease of operation
If optical modules are mounted on a printed circuit board, then optical communication can be performed, but heat generated by the laser causes strict temperature requirements
Solution Approach 1:
Heat dissipation holes and reflective layers are pre-configured within the substrate structure before optical modules are mounted and operated. This preliminary arrangement of heat dissipation pathways ensures that heat can be efficiently removed from the laser from the beginning of operation, maintaining temperature control without interfering with optical communication functionality.
Solution Approach 2:
The heat dissipation system utilizes gas or air flow through the heat dissipation holes to enhance heat removal from the laser. By introducing a fluid medium (air) through the porous substrate structure, convective heat transfer is improved, allowing effective temperature control of the laser while maintaining full optical communication functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat generated by optical modules, preventing heat accumulation and ensuring optimal operating temperatures, thereby enhancing the reliability and longevity of optical modules by improving heat dissipation efficiency.
Implementation Method 1
a piezoelectric film fan, where the piezoelectric film fan includes a hollow body, a film, and a piezoelectric plate
Implementation Method 2
a cross-structured heat sink fin, where the heat sink fin includes multiple first toothed bars horizontally disposed at intervals and multiple second toothed bars vertically disposed at intervals
Implementation Method 3
the piezoelectric film fan enhances airflow through a hollow body and nozzle configuration
Data Source
Figure 1~2
Figure 3a~3b
Figure 4~5
AI summary
Embodiments of the present invention relate to communication fittings technologies, and provide a heat dissipation system for an optical module, to improve heat dissipation efficiency of the optical module. In the embodiments of the present invention, the heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing; a first heat dissipation apparatus is fixedly disposed on the circuit card; a heat dissipation window is provided in an area that is above the laser and on the housing of the optical module; and the first heat dissipation apparatus performs heat dissipation on the heat dissipation window. The present invention is mainly applied to the communications field.