Optical Module Packaging Shielding Layer Integration
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Solution Overview
Problem
Existing optical proximity sensing module packaging technologies are inadequate for the trend of reducing weight and thickness in portable devices, leading to increased manufacturing costs and complexity.
Innovation Solution
A packaging method involving a non-ceramic substrate with defined light-emitting and light-admitting regions, encapsulants, and a shielding layer, where the shielding layer is polished to expose the encapsulants, simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a base, dam, lid, and partition board structure is used to enclose and divide the receiving space, then light-emitting chip and light-admitting chip can be separately disposed to avoid mutual interference, but the packaging process becomes complex and manufacturing costs increase
Solution Approach 1:
The patent combines multiple protective and shielding functions into a single integrated shielding layer structure. The shielding layer simultaneously provides light shielding, mechanical protection, and structural support, eliminating the need for separate base, dam, lid, and partition board components. This merging of functions simplifies the packaging process while maintaining effective separation of light-emitting and light-admitting regions.
Solution Approach 2:
The shielding layer serves multiple purposes: it shields light between the light-emitting chip and light-admitting chip, protects the chips mechanically, and provides structural support for the entire package. This multi-functional design replaces the need for multiple specialized components, reducing manufacturing complexity while maintaining reliability.
2Reliability
If traditional packaging structures with multiple components are used, then optical functionality is maintained, but weight and thickness increase which is inconsistent with the trend of portable devices
Solution Approach 1:
By merging multiple protective components into a single shielding layer, the overall weight of the packaging structure is reduced. The integrated design eliminates redundant materials while maintaining all necessary functions for optical performance and mechanical protection.
Solution Approach 2:
The shielding layer is implemented as a thin film structure that provides adequate protection and light shielding without adding significant weight or thickness. This thin-film approach allows the module to meet the weight and thickness reduction requirements of modern portable devices while maintaining optical functionality.
3Reliability
If traditional packaging structures with multiple components are used, then optical functionality is maintained, but manufacturing costs increase
Solution Approach 1:
The integration of multiple functions into a single shielding layer reduces the number of manufacturing steps and assembly operations required. This simplification directly lowers manufacturing costs while maintaining the optical separation and protection necessary for reliable module operation.
Solution Approach 2:
The multi-functional shielding layer can be manufactured using standard processes, eliminating the need for specialized assembly of multiple components. This universality in both design and manufacturing approach reduces production complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the packaging process and reduces manufacturing costs by using a transparent opaque resin encapsulant and shielding layer, while maintaining effective optical functionality.
Implementation Method 1
forming a transparent encapsulant on the light-emitting chip and the light-admitting chip
Implementation Method 2
forming an opaque shielding layer on the encapsulants and the substrate
Implementation Method 3
removing the shielding layer is achieved by polishing, wherein the shielding layer is polished until the protruding top ends of the encapsulants are exposed
Data Source
AI summary
A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs.