Optical Module Substrate Integration for Fiber Alignment
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Solution Overview
Problem
The miniaturization of optical modules is hindered by the need for separate and complex electrical and optical connections, which complicates the integration of optical fibers and electric fibers within the module.
Innovation Solution
An optical module design featuring a substrate with through holes for optical fibers and electrodes for electric fibers, allowing for integrated optical and electrical connections within the substrate, eliminating the need for external connectors and enhancing alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate electrical connection and optical connection structures are used, then reliable connection is achieved, but device complexity increases and miniaturization becomes difficult
Solution Approach 1:
The patent combines electrical connection and optical connection functions into a single integrated substrate structure. The substrate simultaneously provides electrical pathways through conductive layers and optical pathways through through-holes for fiber insertion, eliminating the need for separate connection structures and reducing overall device complexity while maintaining reliable connections for both electrical and optical signals
2Reliability
If separate electrical connection and optical connection processes are performed, then reliable connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary integration of electrical and optical connection structures during substrate fabrication. Conductive layers are formed, through-holes are created for optical fibers, and electrical pathways are established before final assembly. This preliminary structuring allows both electrical and optical connections to be made simultaneously during assembly, simplifying the manufacturing process while ensuring reliable connections
3Adaptability or versatility
If external connectors and wiring are used for electrical connection, then connection flexibility is maintained, but device size increases
Solution Approach 1:
The patent transitions electrical connection from a planar external wiring approach to a three-dimensional integrated structure within the substrate. Conductive layers are embedded at different depths and positions within the substrate, allowing electrical pathways to route signals directly to the optical device without requiring external connectors or extensive wiring, thereby reducing module size while maintaining connection flexibility
Data Source
AI summary
An optical module includes: a substrate provided with a through hole for inserting an optical fiber from a second principal surface side of the substrate; an optical device provided on a first principal surface side of the substrate; a first electrode provided in the substrate for connecting an electric fiber from the second principal surface side; a second electrode formed on the first principal surface side of the substrate for connecting to the optical device; and a third electrode provided on a side surface of the substrate and electrically connected to the second electrode.