Glass-Board Optical Module for Hermetic Sealing and Thermal Stress Relief
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Solution Overview
Problem
Existing optical modules face challenges in protecting electrical and optical elements from stress caused by temperature changes, which can affect high-speed signal transmission due to hermetic sealing.
Innovation Solution
An optical module design featuring a glass board with vias for thermal and electrical connections, a heat conduction member, and a temperature control element, along with hermetic sealing to protect elements and enable efficient heat transfer and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical elements and optical elements are hermetically sealed within the casing, then protection from moisture and contaminants is improved, but stress due to expansion or contraction from temperature changes affects the elements
Solution Approach 1:
The internal space is divided into a first sealed space containing electrical elements and a second sealed space containing optical elements, with separate lids for each sealing operation. This segmentation allows independent stress management for each element type.
Solution Approach 2:
A stress relief structure is provided that is in contact with both the electrical elements and optical elements, acting as an intermediary to distribute and reduce thermal stress across both spaces. This mediator absorbs expansion/contraction forces to protect the sealed elements.
2Reliability
If hermetic sealing is implemented for both electrical and optical elements, then reliability is improved, but complexity of the sealing structure increases
Solution Approach 1:
The sealing structure is segmented into two separate lids: a first lid for sealing the electrical elements and a second lid for sealing the optical elements. This segmentation simplifies each individual sealing operation while achieving comprehensive protection.
Solution Approach 2:
Both sealing operations are integrated into a single hermetic sealing device that performs both sealing functions, combining multiple protective functions into one unified structure rather than requiring separate external sealing mechanisms.
3Reliability
If stress protection structures are added to protect hermetically sealed elements, then element protection is improved, but device complexity increases
Solution Approach 1:
The stress relief structure is integrated into the hermetic sealing device itself, merging stress protection and sealing functions into a single unified structure. This eliminates the need for separate stress relief components.
Solution Approach 2:
The hermetic sealing device performs multiple functions simultaneously: it provides hermetic sealing against moisture and contaminants, and it incorporates stress relief structures to protect elements from thermal expansion/contraction forces. This multi-functionality reduces overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively protects electrical and optical elements from thermal stress, ensuring reliable high-speed signal transmission by using a glass board with vias for thermal and electrical connections and hermetic sealing.
Implementation Method 1
a heat conduction member mounted on the second face and thermally connected to the electrical element through the via
Implementation Method 2
a temperature control element mounted on the second face, thermally connected to the optical element through the via, and for adjusting temperature of the optical element
Implementation Method 3
The casing is hermetically sealed by closing an opening with the lid. Since the casing is sealed by the lid, moisture and the like are prevented from entering the inside of the casing
Data Source
AI summary
An optical module according to one embodiment includes: a glass board having a first face, a second face, and a via. The optical module includes: an electrical element mounted on the first face; a heat conduction member mounted on the second face and thermally connected to an electrical element through the via, and an optical element mounted on the first face and converting between the electrical signal and the optical signal. The optical module includes: a temperature control element mounted on the second face and thermally connected to the optical element through the via and for adjusting the temperature of the optical element; electrical wiring electrically connecting the electrical element to the optical element and constituting a transmission line for transmitting the electrical signal; and a first housing connected to the first face and hermetically sealing the electrical element and the optical element.